是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 包装说明: | 6 X 6 MM, ROHS COMPLIANT, MO-220VJJD, QFN-36 |
Reach Compliance Code: | compliant | HTS代码: | 8542.39.00.01 |
风险等级: | 1.75 | JESD-30 代码: | S-XQCC-N36 |
长度: | 6 mm | 功能数量: | 1 |
端子数量: | 36 | 最高工作温度: | 85 °C |
最低工作温度: | -40 °C | 封装主体材料: | UNSPECIFIED |
封装代码: | HVQCCN | 封装形状: | SQUARE |
封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | 峰值回流温度(摄氏度): | NOT SPECIFIED |
座面最大高度: | 0.9 mm | 标称供电电压: | 2.5 V |
表面贴装: | YES | 电信集成电路类型: | ATM/SONET/SDH SUPPORT CIRCUIT |
温度等级: | INDUSTRIAL | 端子形式: | NO LEAD |
端子节距: | 0.5 mm | 端子位置: | QUAD |
处于峰值回流温度下的最长时间: | NOT SPECIFIED | 宽度: | 6 mm |
Base Number Matches: | 1 |
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IC CLK BUFFER 2:4 725MHZ 16QFN |