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S72WS256ND0BFW932

更新时间： 2024-01-07 20:32:04

品牌	Logo	应用领域
飞索 - SPANSION		内存集成电路存储
页数	文件大小	规格书
28页	1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137

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D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )

ALH160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package

NOTES:

PACKAGE

JEDEC

ALH 160

N/A

1. DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

D x E

15.00 mm x 15.00 mm

PACKAGE

2. ALL DIMENSIONS ARE IN MILLIMETERS.

3. BALL POSITION DESIGNATION PER JEP95, SECTION

4.3, SPP-010.

SYMBOL

MIN

NOM

---

MAX

NOTE

---

1.10

---

PROFILE

e REPRESENTS THE SOLDER BALL GRID PITCH.

0.38

0.53

---

BALL HEIGHT

5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

---

0.65

BODY THICKNESS

15.00 BSC.

13.65 BSC.

BODY SIZE

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

BODY SIZE

n IS THE NUMBER OF POPULATED SOLDER BALL

POSITIONS FOR MATRIX SIZE MD X ME.

MATRIX FOOTPRINT

MATRIX SIZE D DIRECTION

MATRIX SIZE E DIRECTION

BALL COUNT

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER

BALL IN THE OUTER ROW.

160

MAXIMUM NUMBER OF BALLS

NUMBER OF LAND PERIMETERS

BALL DIAMETER

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE

OUTER ROW SD OR SE = 0.000.

Øb

SD SE

0.43

0.48

0.53

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE

OUTER ROW, SD OR SE = e/2

0.65 BSC.

0.65 BSC

0.325 BSC.

BALL PITCH

8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

BALL PITCH

SOLDER BALL PLACEMENT

DEPOPULATED SOLDER BALLS

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

S72WS-N Based MCP/PoP Products

S72WS-N_00_A9 May 8, 2007

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