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S72WS256ND0BFW932

更新时间： 2024-02-11 01:50:46

品牌	Logo	应用领域
飞索 - SPANSION		内存集成电路存储
页数	文件大小	规格书
28页	1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137

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D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )

Colophon

The products described in this document are designed, developed and manufactured as contemplated for general use, including without

limitation, ordinary industrial use, general office use, personal use, and household use, but are not designed, developed and manufactured as

contemplated (1) for any use that includes fatal risks or dangers that, unless extremely high safety is secured, could have a serious effect to the

public, and could lead directly to death, personal injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility,

aircraft flight control, air traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2) for

any use where chance of failure is intolerable (i.e., submersible repeater and artificial satellite). Please note that Spansion will not be liable to

you and/or any third party for any claims or damages arising in connection with above-mentioned uses of the products. Any semiconductor

devices have an inherent chance of failure. You must protect against injury, damage or loss from such failures by incorporating safety design

measures into your facility and equipment such as redundancy, fire protection, and prevention of over-current levels and other abnormal

operating conditions. If any products described in this document represent goods or technologies subject to certain restrictions on export under

the Foreign Exchange and Foreign Trade Law of Japan, the US Export Administration Regulations or the applicable laws of any other country,

the prior authorization by the respective government entity will be required for export of those products.

Trademarks and Notice

The contents of this document are subject to change without notice. This document may contain information on a Spansion product under

development by Spansion. Spansion reserves the right to change or discontinue work on any product without notice. The information in this

document is provided as is without warranty or guarantee of any kind as to its accuracy, completeness, operability, fitness for particular purpose,

merchantability, non-infringement of third-party rights, or any other warranty, express, implied, or statutory. Spansion assumes no liability for any

damages of any kind arising out of the use of the information in this document.

and combinations thereof, are trademarks of Spansion LLC in the US and other countries. Other names used are for informational purposes

only and may be trademarks of their respective owners.

S72WS-N Based MCP/PoP Products

S72WS-N_00_A9 May 8, 2007

1...25 26 2728

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与S72WS256ND0BFW932相关器件

型号	品牌	描述	获取价格	数据表
S72WS256ND0BFW933	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137	获取价格
S72WS256ND0BFWB7	SPANSION	Based MCP/PoP Products	获取价格
S72WS256ND0BFWB70	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137	获取价格
S72WS256ND0BFWB72	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137	获取价格
S72WS256ND0BFWBB	SPANSION	Based MCP/PoP Products	获取价格
S72WS256ND0BFWBB2	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137	获取价格

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