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S72WS256ND0BFW932

更新时间： 2024-02-13 23:48:50

品牌	Logo	应用领域
飞索 - SPANSION		内存集成电路存储
页数	文件大小	规格书
28页	1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137

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D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )

FVD137—137-ball Fine-Pitch Ball Grid Array (FBGA) 11 x 13 mm Package

0.15

(2X)

PIN A1

CORNER

PIN A1

CORNER

INDEX MARK

0.15

(2X)

TOP VIEW

SIDE VIEW

BOTTOM VIEW

0.20

0.08

137X

0.15

0.08

A B

NOTES:

PACKAGE

JEDEC

FVD 137

N/A

1. DIMENSIONING AND TOLERANCING METHODS PER

ASME Y14.5M-1994.

2. ALL DIMENSIONS ARE IN MILLIMETERS.

D x E

13.00 mm x 11.00 mm

PACKAGE

NOTE

3. BALL POSITION DESIGNATION PER JEP95, SECTION

4.3, SPP-010.

SYMBOL

MIN

NOM

---

MAX

1.40

e REPRESENTS THE SOLDER BALL GRID PITCH.

---

PROFILE

5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"

DIRECTION.

0.10

1.09

---

BALL HEIGHT

---

1.24

BODY THICKNESS

BODY SIZE

SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE

"E" DIRECTION.

13.00 BSC.

11.00 BSC.

10.40 BSC.

7.20 BSC.

BODY SIZE

n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS

FOR MATRIX SIZE MD X ME.

MATRIX FOOTPRINT

DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL

DIAMETER IN A PLANE PARALLEL TO DATUM C.

MATRIX SIZE D DIRECTION

MATRIX SIZE E DIRECTION

BALL COUNT

SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A

AND B AND DEFINE THE POSITION OF THE CENTER SOLDER

BALL IN THE OUTER ROW.

137

WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE

OUTER ROW SD OR SE = 0.000.

Øb

0.35

0.40

0.45

BALL DIAMETER

0.80 BSC.

0.80 BSC

0.40 BSC.

G5,H5,H6

BALL PITCH

WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE

OUTER ROW, SD OR SE = e/2

SD SE

BALL PITCH

SOLDER BALL PLACEMENT

DEPOPULATED SOLDER BALLS

8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED

BALLS.

A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK

MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.

3522 \ 16-038.21 \ 09.29.05

S72WS-N Based MCP/PoP Products

S72WS-N_00_A9 May 8, 2007

1...19 20 212223 24 25...28

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