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S72WS256NDEBAWUB3

更新时间： 2024-01-02 12:24:26

品牌	Logo	应用领域
飞索 - SPANSION		动态存储器内存集成电路
页数	文件大小	规格书
28页	1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-137

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S72WS256NDEBAWUB3 技术参数

生命周期：	Active	Reach Compliance Code：	compliant
风险等级：	5.84

S72WS-N Based MCP/PoP Products

1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus

256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory

512 Mb NAND Flash

1024 Mb NAND Interface ORNAND Flash Memory on Bus 1

512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on

Bus 2

S72WS-N Based MCP/PoP Products Cover Sheet

Data Sheet (Advance Information)

Notice to Readers: This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

Publication Number S72WS-N_00

Revision A

Amendment 9

Issue Date May 8, 2007

12 3 4 5 6 7...28

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型号	品牌	描述	获取价格	数据表
S72WS256NDEBFW4Y0	SPANSION	Based MCP/PoP Products	获取价格
S72WS256NDEBFW4Y2	SPANSION	Based MCP/PoP Products	获取价格
S72WS256NDEBFW4Y3	SPANSION	Based MCP/PoP Products	获取价格
S72WS256NDEBFWU7	SPANSION	Based MCP/PoP Products	获取价格
S72WS256NDEBFWU72	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137	获取价格
S72WS256NDEBFWU73	SPANSION	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137	获取价格