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S72WS256NDEBAWUB3 PDF预览

S72WS256NDEBAWUB3

更新时间: 2024-02-29 20:04:03
品牌 Logo 应用领域
飞索 - SPANSION 动态存储器内存集成电路
页数 文件大小 规格书
28页 1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-137

S72WS256NDEBAWUB3 技术参数

生命周期:ActiveReach Compliance Code:compliant
风险等级:5.84

S72WS256NDEBAWUB3 数据手册

 浏览型号S72WS256NDEBAWUB3的Datasheet PDF文件第1页浏览型号S72WS256NDEBAWUB3的Datasheet PDF文件第2页浏览型号S72WS256NDEBAWUB3的Datasheet PDF文件第4页浏览型号S72WS256NDEBAWUB3的Datasheet PDF文件第5页浏览型号S72WS256NDEBAWUB3的Datasheet PDF文件第6页浏览型号S72WS256NDEBAWUB3的Datasheet PDF文件第7页 
S72WS-N Based MCP/PoP Products  
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus  
256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory  
512 Mb NAND Flash  
1024 Mb NAND Interface ORNAND Flash Memory on Bus 1  
512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on  
Bus 2  
Data Sheet (Advance Information)  
Features  
„ Power supply voltage of 1.7 to 1.95V  
„ Package:  
High Performance  
„ Flash access time: 80 ns for NOR Flash, 25 ns for ORNAND  
– 9.0 x 12.0 mm MCP BGA  
– 11.0 x 13.0 mm MCP BGA  
– 15.0 x 15.0 x 1.2 mm MCP Package-on-Package (PoP)  
Flash  
„ Flash burst frequencies: 54 MHz, 66MHz, 80MHz  
„ Operating Temperature  
„ Mobile SDRAM burst frequency: 104 MHz, 133 MHz (DDR)  
– –25°C to +85°C (wireless)  
General Description  
The S72WS series is a product line of stacked Multi-Chip Product (MCP) packages and consists of:  
„ One or two NOR flash memory dies  
„ One NAND Interface ORNAND die  
„ Separate bus for one or more Mobile SDRAM die  
The products covered by this document are listed in the table below.  
NOR Flash Density  
NAND Flash Density  
1024Mb 512Mb  
SDRAM Density  
256Mb  
Device  
512Mb  
256Mb  
128Mb  
512Mb  
128Mb  
S72WS256ND0  
S72WS256NDE  
S72WS256NEE  
S72WS512NFG  
S72WS512NEG  
S72WS512NEF  
S72WS512NFF  
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
Note  
For a list of PoP OPNs, please contact the local sales representative or refer to the valid combinations tables.  
For detailed specifications, please refer to the individual data sheets.  
Document  
Publication Identification Number (PID)  
S29WS-N_00  
S30MS-P_00  
SDRAM_01  
S29WS256N  
S30MS01GP/512P  
128 Mb Mobile SDRAM Type 1  
128 Mb Mobile SDRAM Type 2  
128 Mb Mobile DDR-DRAM Type 5  
256 Mb Mobile SDRAM Type 2  
512 Mb Mobile DDR-DRAM Type 1  
512 Mb Mobile SDRAM Type 4  
512 Mb NAND Type 1  
SDRAM_05  
SDRAM_07  
SDRAM_05  
SDRAM_09  
SDRAM_06  
NAND_01  
512 Mb Mobile DDR-DRAM Type 5  
512 Mb Mobile DDR-DRAM Type 2  
DRAM_04  
DRAM_05  
Publication Number S72WS-N_00  
Revision A  
Amendment 9  
Issue Date May 8, 2007  
This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in  
this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.  

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