是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | FBGA, BGA137,10X14,32 | Reach Compliance Code: | compliant |
风险等级: | 5.84 | 最长访问时间: | 70 ns |
JESD-30 代码: | R-PBGA-B137 | 内存集成电路类型: | MEMORY CIRCUIT |
混合内存类型: | FLASH+SDRAM | 端子数量: | 137 |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | FBGA |
封装等效代码: | BGA137,10X14,32 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, FINE PITCH | 电源: | 1.8 V |
认证状态: | Not Qualified | 最大待机电流: | 0.00004 A |
子类别: | Other Memory ICs | 最大压摆率: | 0.06 mA |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子形式: | BALL | 端子节距: | 0.8 mm |
端子位置: | BOTTOM |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
S72WS256NEEBAWUB | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEEBAWUB0 | SPANSION |
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Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBG | |
S72WS256NEEBFW4Y0 | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEEBFW4Y2 | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEEBFW4Y3 | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEEBFWU7 | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEEBFWU70 | SPANSION |
获取价格 |
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137 | |
S72WS256NEEBFWU72 | SPANSION |
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Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137 | |
S72WS256NEEBFWU73 | SPANSION |
获取价格 |
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137 | |
S72WS256NEEBFWUB | SPANSION |
获取价格 |
Based MCP/PoP Products |