5秒后页面跳转
S72WS256NEEBFWU72 PDF预览

S72WS256NEEBFWU72

更新时间: 2024-11-24 14:18:27
品牌 Logo 应用领域
飞索 - SPANSION 动态存储器内存集成电路
页数 文件大小 规格书
28页 1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137

S72WS256NEEBFWU72 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:BGA包装说明:LFBGA,
针数:137Reach Compliance Code:compliant
HTS代码:8542.32.00.71风险等级:5.84
Is Samacsys:N其他特性:MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE
JESD-30 代码:R-PBGA-B137JESD-609代码:e1
长度:12 mm内存密度:268435456 bit
内存集成电路类型:MEMORY CIRCUIT内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:137字数:16777216 words
字数代码:16000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-25 °C
组织:16MX16封装主体材料:PLASTIC/EPOXY
封装代码:LFBGA封装形状:RECTANGULAR
封装形式:GRID ARRAY, LOW PROFILE, FINE PITCH峰值回流温度(摄氏度):260
认证状态:Not Qualified座面最大高度:1.4 mm
最大供电电压 (Vsup):1.95 V最小供电电压 (Vsup):1.7 V
标称供电电压 (Vsup):1.8 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:TIN SILVER COPPER端子形式:BALL
端子节距:0.8 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:40宽度:9 mm
Base Number Matches:1

S72WS256NEEBFWU72 数据手册

 浏览型号S72WS256NEEBFWU72的Datasheet PDF文件第2页浏览型号S72WS256NEEBFWU72的Datasheet PDF文件第3页浏览型号S72WS256NEEBFWU72的Datasheet PDF文件第4页浏览型号S72WS256NEEBFWU72的Datasheet PDF文件第5页浏览型号S72WS256NEEBFWU72的Datasheet PDF文件第6页浏览型号S72WS256NEEBFWU72的Datasheet PDF文件第7页 
S72WS-N Based MCP/PoP Products  
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus  
256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory  
512 Mb NAND Flash  
1024 Mb NAND Interface ORNAND Flash Memory on Bus 1  
512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on  
Bus 2  
S72WS-N Based MCP/PoP Products Cover Sheet  
Data Sheet (Advance Information)  
Notice to Readers: This document states the current technical specifications regarding the Spansion  
product(s) described herein. Each product described herein may be designated as Advance Information,  
Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.  
Publication Number S72WS-N_00  
Revision A  
Amendment 9  
Issue Date May 8, 2007  

与S72WS256NEEBFWU72相关器件

型号 品牌 获取价格 描述 数据表
S72WS256NEEBFWU73 SPANSION

获取价格

Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256NEEBFWUB SPANSION

获取价格

Based MCP/PoP Products
S72WS256NEEKFW4Y0 SPANSION

获取价格

Based MCP/PoP Products
S72WS256NEEKFW4Y2 SPANSION

获取价格

Based MCP/PoP Products
S72WS256NEEKFW4Y3 SPANSION

获取价格

Based MCP/PoP Products
S72WS256NEFBAW4Y0 SPANSION

获取价格

Based MCP/PoP Products
S72WS256NEFBAW4Y2 SPANSION

获取价格

Based MCP/PoP Products
S72WS256NEFBAW4Y3 SPANSION

获取价格

Based MCP/PoP Products
S72WS256NEFBFW4Y0 SPANSION

获取价格

Based MCP/PoP Products
S72WS256NEFBFW4Y2 SPANSION

获取价格

Based MCP/PoP Products