是否Rohs认证: | 符合 | 生命周期: | Obsolete |
零件包装代码: | BGA | 包装说明: | LFBGA, |
针数: | 137 | Reach Compliance Code: | compliant |
HTS代码: | 8542.32.00.71 | 风险等级: | 5.84 |
Is Samacsys: | N | 其他特性: | MOBILE SDRAM IS ORGANIZED AS 4M X 16BIT X 4 BANKS; SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
JESD-30 代码: | R-PBGA-B137 | JESD-609代码: | e1 |
长度: | 12 mm | 内存密度: | 268435456 bit |
内存集成电路类型: | MEMORY CIRCUIT | 内存宽度: | 16 |
湿度敏感等级: | 3 | 功能数量: | 1 |
端子数量: | 137 | 字数: | 16777216 words |
字数代码: | 16000000 | 工作模式: | ASYNCHRONOUS |
最高工作温度: | 85 °C | 最低工作温度: | -25 °C |
组织: | 16MX16 | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | LFBGA | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY, LOW PROFILE, FINE PITCH | 峰值回流温度(摄氏度): | 260 |
认证状态: | Not Qualified | 座面最大高度: | 1.4 mm |
最大供电电压 (Vsup): | 1.95 V | 最小供电电压 (Vsup): | 1.7 V |
标称供电电压 (Vsup): | 1.8 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | OTHER |
端子面层: | TIN SILVER COPPER | 端子形式: | BALL |
端子节距: | 0.8 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 40 | 宽度: | 9 mm |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
S72WS256NEEBFWU73 | SPANSION |
获取价格 |
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137 | |
S72WS256NEEBFWUB | SPANSION |
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Based MCP/PoP Products | |
S72WS256NEEKFW4Y0 | SPANSION |
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Based MCP/PoP Products | |
S72WS256NEEKFW4Y2 | SPANSION |
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Based MCP/PoP Products | |
S72WS256NEEKFW4Y3 | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEFBAW4Y0 | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEFBAW4Y2 | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEFBAW4Y3 | SPANSION |
获取价格 |
Based MCP/PoP Products | |
S72WS256NEFBFW4Y0 | SPANSION |
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Based MCP/PoP Products | |
S72WS256NEFBFW4Y2 | SPANSION |
获取价格 |
Based MCP/PoP Products |