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S72WS256NEEBAWU7

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S72WS256NEEBAWU7 数据手册

S72WS-N Based MCP/PoP Products

1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus

256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory

512 Mb NAND Flash

1024 Mb NAND Interface ORNAND Flash Memory on Bus 1

512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on Bus 2

ADVANCE

INFORMATION

Data Sheet

Notice to Readers: This document states the current technical specifications

regarding the Spansion product(s) described herein. Each product described

herein may be designated as Advance Information, Preliminary, or Full

Production. See “Notice On Data Sheet Designations” for definitions.

Publication Number S72WS-N_00 Revision A Amendment 8 Issue Date June 1, 2006

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型号	品牌	获取价格	描述	数据表
S72WS256NEEBAWU72	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBG
S72WS256NEEBAWUB	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NEEBAWUB0	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBG
S72WS256NEEBFW4Y0	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NEEBFW4Y2	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NEEBFW4Y3	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NEEBFWU7	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NEEBFWU70	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256NEEBFWU72	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256NEEBFWU73	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137