D a t a S h e e t ( A d v a n c e I n f o r m a t i o n )
BWB160—160-ball Fine-Pitch Ball Grid Array (FBGA) 15 x 15 mm Package
NOTES:
PACKAGE
JEDEC
BWB 160
N/A
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2. ALL DIMENSIONS ARE IN MILLIMETERS.
D x E
15.00 mm x 15.00 mm
PACKAGE
NOTE
3. BALL POSITION DESIGNATION PER JEP95, SECTION
4.3, SPP-010.
SYMBOL
MIN
NOM
---
MAX
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
A
A1
A2
D
---
1.30
---
PROFILE
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
0.38
0.74
---
BALL HEIGHT
---
0.84
BODY THICKNESS
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
15.00 BSC.
15.00 BSC.
13.65 BSC.
13.65 BSC.
22
BODY SIZE
E
BODY SIZE
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
D1
E1
MD
ME
n
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
6
7
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
22
160
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
N
160
MAXIMUM NUMBER OF BALLS
NUMBER OF LAND PARAMETERS
BALL DIAMETER
R
2
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
Øb
eE
eD
SD / SE
0.43
0.48
0.53
0.65 BSC.
0.65 BSC.
0.325 BSC.
BALL PITCH
8. "+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
BALL PITCH
9
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
3523.3 \ 16-038.46 \ 5.7.7
24
S72WS-N Based MCP/PoP Products
S72WS-N_00_A9 May 8, 2007