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S72WS256NDEBAWUB0

更新时间： 2024-11-25 05:17:27

品牌	Logo	应用领域
飞索 - SPANSION		内存集成电路存储
页数	文件大小	规格书
28页	1252K
描述
Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBGA-137

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S72WS256NDEBAWUB0 数据手册

S72WS-N Based MCP/PoP Products

1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus

256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory

512 Mb NAND Flash

1024 Mb NAND Interface ORNAND Flash Memory on Bus 1

512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on

Bus 2

S72WS-N Based MCP/PoP Products Cover Sheet

Data Sheet (Advance Information)

Notice to Readers: This document states the current technical specifications regarding the Spansion

product(s) described herein. Each product described herein may be designated as Advance Information,

Preliminary, or Full Production. See Notice On Data Sheet Designations for definitions.

Publication Number S72WS-N_00

Revision A

Amendment 9

Issue Date May 8, 2007

12 3 4 5 6 7...28

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型号	品牌	获取价格	描述	数据表
S72WS256NDEBAWUB3	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE COMPLIANT, FBG
S72WS256NDEBFW4Y0	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NDEBFW4Y2	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NDEBFW4Y3	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NDEBFWU7	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NDEBFWU72	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256NDEBFWU73	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256NDEBFWUB	SPANSION	获取价格	Based MCP/PoP Products
S72WS256NDEBFWUB2	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256NDEBFWUB3	SPANSION	获取价格	Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.40 MM HEIGHT, LEAD FREE, FBGA-137