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S72WS256ND0BFWB7 PDF预览

S72WS256ND0BFWB7

更新时间: 2024-11-27 04:06:43
品牌 Logo 应用领域
飞索 - SPANSION /
页数 文件大小 规格书
30页 980K
描述
Based MCP/PoP Products

S72WS256ND0BFWB7 数据手册

 浏览型号S72WS256ND0BFWB7的Datasheet PDF文件第2页浏览型号S72WS256ND0BFWB7的Datasheet PDF文件第3页浏览型号S72WS256ND0BFWB7的Datasheet PDF文件第4页浏览型号S72WS256ND0BFWB7的Datasheet PDF文件第5页浏览型号S72WS256ND0BFWB7的Datasheet PDF文件第6页浏览型号S72WS256ND0BFWB7的Datasheet PDF文件第7页 
S72WS-N Based MCP/PoP Products  
1.8 Volt-only x16 Flash Memory and SDRAM on Split Bus  
256/512 Mb Simultaneous Read/Write, Burst Mode Flash Memory  
512 Mb NAND Flash  
1024 Mb NAND Interface ORNAND Flash Memory on Bus 1  
512/256/128 Mb (8M/4M/2M x 16-bit x 4 Banks) Mobile SDRAM on Bus 2  
ADVANCE  
INFORMATION  
Data Sheet  
Notice to Readers: This document states the current technical specifications  
regarding the Spansion product(s) described herein. Each product described  
herein may be designated as Advance Information, Preliminary, or Full  
Production. See “Notice On Data Sheet Designations” for definitions.  
Publication Number S72WS-N_00 Revision A Amendment 8 Issue Date June 1, 2006  

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S72WS256ND0BFWB70 SPANSION

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Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFWB72 SPANSION

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Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0BFWBB SPANSION

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S72WS256ND0BFWBB2 SPANSION

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Memory Circuit, 16MX16, CMOS, PBGA137, 9 X 12 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-137
S72WS256ND0KFW4Y0 SPANSION

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S72WS256ND0KFW4Y2 SPANSION

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S72WS256ND0KFW4Y3 SPANSION

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S72WS256ND0KFWD3 SPANSION

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S72WS256ND0KFWD33 SPANSION

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Memory Circuit, 16MX16, CMOS, PBGA160, 15 X 15 MM, 1.25 MM HEIGHT, LEAD FREE, FBGA-160
S72WS256NDE SPANSION

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