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RFP12N06 PDF预览

RFP12N06

更新时间: 2024-11-08 22:24:07
品牌 Logo 应用领域
飞兆/仙童 - FAIRCHILD /
页数 文件大小 规格书
10页 216K
描述
17A, 60V, 0.071 Ohm, N-Channel, Logic Level UltraFET Power MOSFET

RFP12N06 数据手册

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RFD12N06RLE, RFD12N06RLESM,  
RFP12N06RLE  
Data Sheet  
January 2002  
17A, 60V, 0.071 Ohm, N-Channel, Logic  
Level UltraFET Power MOSFET  
Packaging  
Features  
• Ultra Low On-Resistance  
JEDEC TO-251AA  
JEDEC TO-252AA  
DRAIN  
SOURCE  
DRAIN  
GATE  
- r  
- r  
= 0.063Ω, VGS = 10V  
= 0.071Ω, VGS = 5V  
DS(ON)  
DS(ON)  
DRAIN  
(FLANGE)  
(FLANGE)  
GATE  
• Simulation Models  
SOURCE  
®
©
- Temperature Compensated PSPICE and SABER  
Electrical Models  
RFD12N06RLE  
RFD12N06RLESM  
©
- Spice and SABER Thermal Impedance Models  
JEDEC TO-220AB  
- www.fairchildsemi.com  
• Peak Current vs Pulse Width Curve  
• UIS Rating Curve  
SOURCE  
DRAIN  
GATE  
DRAIN (FLANGE)  
• Switching Time vs R  
Curves  
GS  
Ordering Information  
RFP12N06RLE  
PART NUMBER  
RFD12N06RLE  
PACKAGE  
BRAND  
12N6LE  
TO-251AA  
TO-252AA  
TO-220AB  
Symbol  
RFD12N06RLESM  
RFP12N06RLE  
12N6LE  
D
12N06RLE  
NOTE: When ordering, use the entire part number. Add the suffix T to  
obtain the TO-252AA variant in tape and reel, i.e. RFD12N06RLESM9A.  
G
S
o
Absolute Maximum Ratings  
T = 25 C, Unless Otherwise Specified  
C
RFD12N06RLE, RFD12N06RLESM,  
RFP12N06RLE  
UNITS  
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
60  
60  
V
V
V
DSS  
Drain to Gate Voltage (R  
= 20k) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . V  
GS  
DGR  
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V  
±16  
GS  
Drain Current  
o
Continuous (T = 25 C, V  
C
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . .I  
17  
18  
8
8
A
A
A
A
GS  
GS  
D
D
o
Continuous (T = 25 C, V  
C
o
Continuous (T = 135 C, V  
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . .I  
C
GS  
GS  
D
o
Continuous (T = 135 C, V  
C
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I  
Figure 4  
Figures 6, 17, 18  
49  
DM  
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS  
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P  
W
D
o
o
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  
0.327  
W/ C  
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T  
-55 to 175  
C
J
STG  
Maximum Temperature for Soldering  
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . T  
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . .T  
o
300  
260  
C
C
L
o
pkg  
NOTE:  
o
o
1. T = 25 C to 150 C.  
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the  
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.  
©2002 Fairchild Semiconductor Corporation  
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B  

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