RFD12N06RLE, RFD12N06RLESM,
RFP12N06RLE
Data Sheet
January 2002
17A, 60V, 0.071 Ohm, N-Channel, Logic
Level UltraFET Power MOSFET
Packaging
Features
• Ultra Low On-Resistance
JEDEC TO-251AA
JEDEC TO-252AA
DRAIN
SOURCE
DRAIN
GATE
- r
- r
= 0.063Ω, VGS = 10V
= 0.071Ω, VGS = 5V
DS(ON)
DS(ON)
DRAIN
(FLANGE)
(FLANGE)
GATE
• Simulation Models
SOURCE
®
©
- Temperature Compensated PSPICE and SABER
Electrical Models
RFD12N06RLE
RFD12N06RLESM
©
- Spice and SABER Thermal Impedance Models
JEDEC TO-220AB
- www.fairchildsemi.com
• Peak Current vs Pulse Width Curve
• UIS Rating Curve
SOURCE
DRAIN
GATE
DRAIN (FLANGE)
• Switching Time vs R
Curves
GS
Ordering Information
RFP12N06RLE
PART NUMBER
RFD12N06RLE
PACKAGE
BRAND
12N6LE
TO-251AA
TO-252AA
TO-220AB
Symbol
RFD12N06RLESM
RFP12N06RLE
12N6LE
D
12N06RLE
NOTE: When ordering, use the entire part number. Add the suffix T to
obtain the TO-252AA variant in tape and reel, i.e. RFD12N06RLESM9A.
G
S
o
Absolute Maximum Ratings
T = 25 C, Unless Otherwise Specified
C
RFD12N06RLE, RFD12N06RLESM,
RFP12N06RLE
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
60
60
V
V
V
DSS
Drain to Gate Voltage (R
= 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
±16
GS
Drain Current
o
Continuous (T = 25 C, V
C
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 10V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . .I
17
18
8
8
A
A
A
A
GS
GS
D
D
o
Continuous (T = 25 C, V
C
o
Continuous (T = 135 C, V
= 5V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
= 4.5V) (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . .I
C
GS
GS
D
o
Continuous (T = 135 C, V
C
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
Figure 4
Figures 6, 17, 18
49
DM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . UIS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
W
D
o
o
Derate Above 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
0.327
W/ C
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
-55 to 175
C
J
STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . T
Package Body for 10s, See Techbrief TB334. . . . . . . . . . . . . . . . . . . . . . . . . . .T
o
300
260
C
C
L
o
pkg
NOTE:
o
o
1. T = 25 C to 150 C.
J
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
©2002 Fairchild Semiconductor Corporation
RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Rev. B