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PMDPB65UP PDF预览

PMDPB65UP

更新时间: 2024-09-15 19:38:11
品牌 Logo 应用领域
恩智浦 - NXP 开关光电二极管晶体管
页数 文件大小 规格书
15页 193K
描述
TRANSISTOR 3.5 mA, 20 V, 2 CHANNEL, P-CHANNEL, Si, SMALL SIGNAL, MOSFET, 2 X 2 MM, 0.65 MM HEIGHT, LEADLESS, ULTRA THIN, PLASTIC, HUSON-6, FET General Purpose Small Signal

PMDPB65UP 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Transferred包装说明:SMALL OUTLINE, S-PDSO-N6
针数:6Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.74
外壳连接:DRAIN配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:20 V最大漏极电流 (ID):0.0035 A
最大漏源导通电阻:0.09 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:S-PDSO-N6JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:6工作模式:ENHANCEMENT MODE
封装主体材料:PLASTIC/EPOXY封装形状:SQUARE
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性/信道类型:P-CHANNEL认证状态:Not Qualified
表面贴装:YES端子面层:TIN
端子形式:NO LEAD端子位置:DUAL
处于峰值回流温度下的最长时间:30晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

PMDPB65UP 数据手册

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PMDPB65UP  
20 V, 3.5 A dual P-channel Trench MOSFET  
Rev. 2 — 8 March 2011  
Product data sheet  
1. Product profile  
1.1 General description  
Dual small-signal P-channel enhancement mode Field-Effect Transistor (FET) in a small  
and leadless ultra thin SOT1118 Surface-Mounted Device (SMD) plastic package using  
Trench MOSFET technology.  
1.2 Features and benefits  
Trench MOSFET technology  
Small and leadless ultra thin SMD  
plastic package: 2 × 2 × 0.65 mm  
1.8 V RDSon rated for low voltage gate  
drive  
Exposed drain pad for excellent  
thermal conduction  
1 kV ElectroStatic Discharge (ESD)  
protection  
1.3 Applications  
Charging switch for portable devices  
DC-to-DC converters  
Power management in battery-driven  
portables  
Hard disk and computing power  
Small brushless DC motor drive  
management  
1.4 Quick reference data  
Table 1.  
Symbol  
Quick reference data  
Parameter Conditions  
Min Typ Max Unit  
Per transistor  
VDS  
VGS  
ID  
drain-source  
voltage  
Tamb = 25 °C  
-
-
-
-
-20  
8
V
V
A
gate-source  
voltage  
-8  
-
[1]  
drain current  
VGS = -4.5 V; Tamb = 25 °C  
-3.5  
Static characteristics (per transistor)  
RDSon  
drain-source  
on-state  
resistance  
VGS = -4.5 V; ID = -1 A;  
tp 300 µs; δ ≤ 0.01 ;  
Tj = 25 °C  
-
58  
70  
mΩ  
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for  
drain 6 cm2.  
 
 
 
 
 
 

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