NTR0202PL, NVTR0202PL
Power MOSFET
−20 V, −400 mA, P−Channel
SOT−23 Package
Features
http://onsemi.com
• Low R
Provides Higher Efficiency and Extends Battery Life
DS(on)
R
R
= 0.80 W, V = −10 V
DSon
GS
V
R
Typ
I MAX
D
(BR)DSS
DS(on)
= 1.10 W, V = −4.5 V
DSon
GS
−20 V
550 mW @ −10 V
−400 mA
• Miniature SOT−23 Surface Mount Package Saves Board Space
• AEC−Q101 Qualified and PPAP Capable − NVTR0202PL
• These Devices are Pb−Free and are RoHS Compliant
P−Channel
D
Applications
• DC−DC Converters
• Computers
G
• Printers
• PCMCIA Cards
• Cellular and Cordless Telephones
S
MARKING DIAGRAM &
PIN ASSIGNMENT
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Rating
Symbol
Value
−20
Unit
V
Drain
3
Drain−to−Source Voltage
V
DSS
Gate−to−Source Voltage − Continuous
V
$20
V
GS
PL M G
Continuous Drain Current @ T = 25°C
I
−0.4
−1.0
A
G
A
D
SOT−23
CASE 318
STYLE 21
Pulsed Drain Current (t ≤ 10 ms)
I
p
DM
1
Gate
2
Total Power Dissipation @ T = 25°C (Note 1)
P
225
mW
A
D
Source
Operating and Storage Temperature Range
T , T
− 55 to
°C
J
stg
150
PL
M
G
= Specific Device Code
= Date Code*
= Pb−Free Package
Thermal Resistance − Junction−to−Ambient
R
556
0.4
°C/W
A
q
JA
(Note: Microdot may be in either location)
Source Current (Body Diode)
I
S
*Date Code orientation may vary depending
upon manufacturing location.
Maximum Lead Temperature for Soldering
T
L
260
°C
Purposes, 1/8″ from case for 10 s
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.
ORDERING INFORMATION
†
Device
Package
Shipping
NTR0202PLT1G
SOT−23
(Pb−Free)
3000 / Tape &
Reel
NTR0202PLT3G
NVTR0202PLT1G
SOT−23
(Pb−Free)
10000 / Tape &
Reel
SOT−23
(Pb−Free)
3000 / Tape &
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
October, 2011 − Rev. 5
NTR0202PL/D