DATA SHEET
www.onsemi.com
MOSFET - Power, Single
N-Channel
80 V, 20 mW, 30 A
V
R
MAX
I MAX
D
(BR)DSS
DS(ON)
20 mW @ 10 V
25 mW @ 4.5 V
80 V
30 A
NVTYS020N08HL
Features
• Small Footprint (3.3 x 3.3 mm) for Compact Design
N−Channel
D (5 − 8)
• Low R
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• AEC−Q101 Qualified and PPAP Capable
DS(on)
G (4)
• These Devices are Pb−Free and are RoHS Compliant
S (1, 2, 3)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
80
Unit
V
V
DSS
Gate−to−Source Voltage
V
GS
20
V
Continuous Drain
Current R
T
= 25°C
= 100°C
= 25°C
I
30
A
C
D
LFPAK8
3.3x3.3
CASE 760AD
q
JC
T
C
21
(Notes 1, 2, 3, 4)
Steady
State
Power Dissipation
T
C
P
42
W
A
D
R
(Notes 1, 2, 3)
q
JC
T
C
= 100°C
21
MARKING DIAGRAM
Continuous Drain
Current R
T = 25°C
A
I
D
8.1
5.7
3.2
1.6
123
q
JA
T = 100°C
A
(Notes 1, 3, 4)
020N
08HL
AWLYW
Steady
State
Power Dissipation
T = 25°C
A
P
W
D
R
(Notes 1, 3)
q
JA
T = 100°C
A
020N08HL = Specific Device Code
= Assembly Location
WL = Wafer Lot
Pulsed Drain Current
T = 25°C, t = 10 ms
I
DM
A
A
p
A
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
Y
= Year
W
= Work Week
Source Current (Body Diode)
I
35.2
254
A
S
Single Pulse Drain−to−Source Avalanche
E
AS
mJ
Energy (I
= 1.5 A)
L(pk)
ORDERING INFORMATION
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Lead Temperature for Soldering Purposes
(1/8″ from case for 10 s)
T
L
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol
Value
3.6
Unit
Junction−to−Case − Steady State (Note 3)
Junction−to−Ambient − Steady State (Note 3)
R
°C/W
q
JC
R
47.6
q
JA
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2. Psi (Y) is used as required per JESD51−12 for packages in which substantially
less than 100% of the heat flows to single case surface.
2
3. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
4. Continuous DC current rating. Maximum current for pulses as long as 1
second is higher but is dependent on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2021
1
Publication Order Number:
May, 2023 − Rev. 1
NVTYS020N08HL/D