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NVTYS020N08HLTWG PDF预览

NVTYS020N08HLTWG

更新时间: 2024-10-29 11:15:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 262K
描述
MOSFET – Power, Single, N-Channel,

NVTYS020N08HLTWG 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single  
N-Channel  
80 V, 20 mW, 30 A  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(ON)  
20 mW @ 10 V  
25 mW @ 4.5 V  
80 V  
30 A  
NVTYS020N08HL  
Features  
Small Footprint (3.3 x 3.3 mm) for Compact Design  
NChannel  
D (5 8)  
Low R  
to Minimize Conduction Losses  
Low Capacitance to Minimize Driver Losses  
AECQ101 Qualified and PPAP Capable  
DS(on)  
G (4)  
These Devices are PbFree and are RoHS Compliant  
S (1, 2, 3)  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
30  
A
C
D
LFPAK8  
3.3x3.3  
CASE 760AD  
q
JC  
T
C
21  
(Notes 1, 2, 3, 4)  
Steady  
State  
Power Dissipation  
T
C
P
42  
W
A
D
R
(Notes 1, 2, 3)  
q
JC  
T
C
= 100°C  
21  
MARKING DIAGRAM  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
8.1  
5.7  
3.2  
1.6  
123  
q
JA  
T = 100°C  
A
(Notes 1, 3, 4)  
020N  
08HL  
AWLYW  
Steady  
State  
Power Dissipation  
T = 25°C  
A
P
W
D
R
(Notes 1, 3)  
q
JA  
T = 100°C  
A
020N08HL = Specific Device Code  
= Assembly Location  
WL = Wafer Lot  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
A
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
Y
= Year  
W
= Work Week  
Source Current (Body Diode)  
I
35.2  
254  
A
S
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 1.5 A)  
L(pk)  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
3.6  
Unit  
JunctiontoCase Steady State (Note 3)  
JunctiontoAmbient Steady State (Note 3)  
R
°C/W  
q
JC  
R
47.6  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which substantially  
less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Continuous DC current rating. Maximum current for pulses as long as 1  
second is higher but is dependent on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
May, 2023 Rev. 1  
NVTYS020N08HL/D  
 

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