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NVTYS027N10MCLTWG PDF预览

NVTYS027N10MCLTWG

更新时间: 2024-10-29 11:11:35
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 372K
描述
MOSFET – Power, Single, N-Channel,

NVTYS027N10MCLTWG 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET – Power, Single,  
N-Channel  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
100 V  
27 mW @ 10 V  
29 A  
32.8 mW @ 4.5 V  
100 V, 27 mW, 29 A  
NVTYS027N10MCL  
NChannel  
D (5 8)  
Features  
Small Footprint (3.3 x 3.3 mm) for Compact Design  
Low R  
to Minimize Conduction Losses  
Low Capacitance to Minimize Driver Losses  
AECQ101 Qualified and PPAP Capable  
DS(on)  
G (4)  
These Devices are PbFree and are RoHS Compliant  
S (1, 2, 3)  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
DraintoSource Voltage  
GatetoSource Voltage  
Symbol  
Value  
100  
20  
Unit  
V
V
DSS  
V
GS  
V
LFPAK8  
3.3x3.3  
CASE 760AD  
Continuous Drain  
Current R  
Steady  
T
T
T
T
= 25°C  
= 100°C  
= 25°C  
= 100°C  
I
29  
A
C
C
C
C
D
State  
q
JC  
21  
(Notes 1, 2, 3)  
Power Dissipation  
Steady  
State  
P
51  
W
W
A
D
D
R
q
JC  
(Notes 1, 2)  
26  
MARKING DIAGRAM  
Continuous Drain  
Current R  
Steady T = 25°C  
State  
I
D
7
A
q
JA  
027N  
10MCL  
AWLYW  
T = 100°C  
A
5
(Notes 1, 2, 3)  
Power Dissipation  
Steady T = 25°C  
State  
P
3.2  
1.6  
128  
39.5  
W
A
R
q
JA  
(Notes 1, 2)  
T = 100°C  
A
027N10MCL = Specific Device Code  
Pulsed Drain Current  
T
C
= 25°C, t = 10 ms  
I
DM  
A
A
p
A
WL  
Y
= Assembly Location  
= Wafer Lot  
= Year  
Source Current (Body Diode)  
I
S
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
+175  
°C  
J
stg  
W
= Work Week  
Single Pulse DraintoSource Avalanche  
E
174  
260  
mJ  
AS  
Energy (I  
= 1.5 A)  
L(pk)  
ORDERING INFORMATION  
Lead Temperature for Soldering Purposes  
(1/8from Case for 10 s)  
T
°C  
L
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
3
Unit  
JunctiontoCase Steady State (Note 2)  
JunctiontoAmbient Steady State (Note 2)  
R
q
JC  
°C/W  
R
q
JA  
47  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2021  
1
Publication Order Number:  
May, 2023 Rev. 1  
NVTYS027N10MCL/D  
 

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