DATA SHEET
www.onsemi.com
MOSFET – Power, Single,
N-Channel
V
R
MAX
I MAX
D
(BR)DSS
DS(on)
100 V
27 mW @ 10 V
29 A
32.8 mW @ 4.5 V
100 V, 27 mW, 29 A
NVTYS027N10MCL
N−Channel
D (5 − 8)
Features
• Small Footprint (3.3 x 3.3 mm) for Compact Design
• Low R
to Minimize Conduction Losses
• Low Capacitance to Minimize Driver Losses
• AEC−Q101 Qualified and PPAP Capable
DS(on)
G (4)
• These Devices are Pb−Free and are RoHS Compliant
S (1, 2, 3)
MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
Parameter
Drain−to−Source Voltage
Gate−to−Source Voltage
Symbol
Value
100
20
Unit
V
V
DSS
V
GS
V
LFPAK8
3.3x3.3
CASE 760AD
Continuous Drain
Current R
Steady
T
T
T
T
= 25°C
= 100°C
= 25°C
= 100°C
I
29
A
C
C
C
C
D
State
q
JC
21
(Notes 1, 2, 3)
Power Dissipation
Steady
State
P
51
W
W
A
D
D
R
q
JC
(Notes 1, 2)
26
MARKING DIAGRAM
Continuous Drain
Current R
Steady T = 25°C
State
I
D
7
A
q
JA
027N
10MCL
AWLYW
T = 100°C
A
5
(Notes 1, 2, 3)
Power Dissipation
Steady T = 25°C
State
P
3.2
1.6
128
39.5
W
A
R
q
JA
(Notes 1, 2)
T = 100°C
A
027N10MCL = Specific Device Code
Pulsed Drain Current
T
C
= 25°C, t = 10 ms
I
DM
A
A
p
A
WL
Y
= Assembly Location
= Wafer Lot
= Year
Source Current (Body Diode)
I
S
Operating Junction and Storage Temperature
Range
T , T
−55 to
+175
°C
J
stg
W
= Work Week
Single Pulse Drain−to−Source Avalanche
E
174
260
mJ
AS
Energy (I
= 1.5 A)
L(pk)
ORDERING INFORMATION
Lead Temperature for Soldering Purposes
(1/8″ from Case for 10 s)
T
°C
L
See detailed ordering, marking and shipping information in the
package dimensions section on page 5 of this data sheet.
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)
Parameter
Symbol
Value
3
Unit
Junction−to−Case − Steady State (Note 2)
Junction−to−Ambient − Steady State (Note 2)
R
q
JC
°C/W
R
q
JA
47
1. The entire application environment impacts the thermal resistance values shown,
they are not constants and are only valid for the particular conditions noted.
2
2. Surface−mounted on FR4 board using a 650 mm , 2 oz. Cu pad.
3. Maximum current for pulses as long as 1 second is higher but is dependent
on pulse duration and duty cycle.
© Semiconductor Components Industries, LLC, 2021
1
Publication Order Number:
May, 2023 − Rev. 1
NVTYS027N10MCL/D