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NVTR0202PLT1G PDF预览

NVTR0202PLT1G

更新时间: 2024-11-25 12:36:43
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
5页 127K
描述
Power MOSFET −20 V, −400 mA, P−Channel SOT−23 Package

NVTR0202PLT1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
Factory Lead Time:2 weeks风险等级:1.51
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:20 V
最大漏极电流 (Abs) (ID):0.4 A最大漏极电流 (ID):0.4 A
最大漏源导通电阻:0.8 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JEDEC-95代码:TO-236ABJESD-30 代码:R-PDSO-G3
JESD-609代码:e3湿度敏感等级:1
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:P-CHANNEL最大功率耗散 (Abs):0.225 W
参考标准:AEC-Q101子类别:Other Transistors
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NVTR0202PLT1G 数据手册

 浏览型号NVTR0202PLT1G的Datasheet PDF文件第2页浏览型号NVTR0202PLT1G的Datasheet PDF文件第3页浏览型号NVTR0202PLT1G的Datasheet PDF文件第4页浏览型号NVTR0202PLT1G的Datasheet PDF文件第5页 
NTR0202PL, NVTR0202PL  
Power MOSFET  
20 V, 400 mA, PChannel  
SOT23 Package  
Features  
http://onsemi.com  
Low R  
Provides Higher Efficiency and Extends Battery Life  
DS(on)  
R
R
= 0.80 W, V = 10 V  
DSon  
GS  
V
R
Typ  
I MAX  
D
(BR)DSS  
DS(on)  
= 1.10 W, V = 4.5 V  
DSon  
GS  
20 V  
550 mW @ 10 V  
400 mA  
Miniature SOT23 Surface Mount Package Saves Board Space  
AECQ101 Qualified and PPAP Capable NVTR0202PL  
These Devices are PbFree and are RoHS Compliant  
PChannel  
D
Applications  
DCDC Converters  
Computers  
G
Printers  
PCMCIA Cards  
Cellular and Cordless Telephones  
S
MARKING DIAGRAM &  
PIN ASSIGNMENT  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Rating  
Symbol  
Value  
20  
Unit  
V
Drain  
3
DraintoSource Voltage  
V
DSS  
GatetoSource Voltage Continuous  
V
$20  
V
GS  
PL M G  
Continuous Drain Current @ T = 25°C  
I
0.4  
1.0  
A
G
A
D
SOT23  
CASE 318  
STYLE 21  
Pulsed Drain Current (t 10 ms)  
I
p
DM  
1
Gate  
2
Total Power Dissipation @ T = 25°C (Note 1)  
P
225  
mW  
A
D
Source  
Operating and Storage Temperature Range  
T , T  
55 to  
°C  
J
stg  
150  
PL  
M
G
= Specific Device Code  
= Date Code*  
= PbFree Package  
Thermal Resistance JunctiontoAmbient  
R
556  
0.4  
°C/W  
A
q
JA  
(Note: Microdot may be in either location)  
Source Current (Body Diode)  
I
S
*Date Code orientation may vary depending  
upon manufacturing location.  
Maximum Lead Temperature for Soldering  
T
L
260  
°C  
Purposes, 1/8from case for 10 s  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2%.  
ORDERING INFORMATION  
Device  
Package  
Shipping  
NTR0202PLT1G  
SOT23  
(PbFree)  
3000 / Tape &  
Reel  
NTR0202PLT3G  
NVTR0202PLT1G  
SOT23  
(PbFree)  
10000 / Tape &  
Reel  
SOT23  
(PbFree)  
3000 / Tape &  
Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
October, 2011 Rev. 5  
NTR0202PL/D  
 

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