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NVTFS6H888NTAG

更新时间: 2024-09-17 11:11:55
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
8页 275K
描述
单 N 沟道,功率 MOSFET,80V,13A,55mΩ

NVTFS6H888NTAG 数据手册

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DATA SHEET  
www.onsemi.com  
MOSFET - Power, Single,  
N-Channel  
V
R
MAX  
I MAX  
D
(BR)DSS  
DS(on)  
80 V  
55 mW @ 10 V  
13 A  
80 V, 55 mW, 13 A  
NChannel  
D (5 8)  
NVTFS6H888N  
Features  
Small Footprint (3.3 x 3.3 mm) for Compact Design  
G (4)  
Low R  
to Minimize Conduction Losses  
DS(on)  
Low Capacitance to Minimize Driver Losses  
NVTFS6H888NWF Wettable Flanks Product  
AECQ101 Qualified and PPAP Capable  
S (1, 2, 3)  
These Devices are PbFree and are RoHS Compliant  
1
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
WDFN8 3.3x3.3, 0.65P  
CASE 511AB  
J
Parameter  
DraintoSource Voltage  
Symbol  
Value  
80  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
I
12  
A
C
D
WDFNW8 3.3x3.3, 0.65P (FullCut m8FL WF)  
q
JC  
T
C
= 100°C  
8.3  
(Notes 1, 2, 3, 4)  
CASE 515AN  
Steady  
State  
Power Dissipation  
T
C
= 25°C  
P
18  
9.2  
4.7  
W
A
D
R
(Notes 1, 2, 3)  
q
JC  
T
C
= 100°C  
MARKING DIAGRAM  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
1
q
JA  
S
S
S
G
D
D
D
D
T = 100°C  
A
3.3  
(Notes 1, 3, 4)  
Steady  
State  
XXXX  
AYWWG  
G
Power Dissipation  
T = 25°C  
A
P
2.9  
1.5  
47  
W
D
R
(Notes 1, 3)  
q
JA  
T = 100°C  
A
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
XXXX = Specific Device Code  
Operating Junction and Storage Temperature  
Range  
T , T  
55 to  
°C  
J
stg  
A
Y
= Assembly Location  
= Year  
+175  
Source Current (Body Diode)  
I
S
15  
47  
A
WW  
G
= Work Week  
= PbFree Package  
(Note: Microdot may be in either location)  
Single Pulse DraintoSource Avalanche  
E
AS  
mJ  
Energy (I  
= 0.6 A)  
L(pk)  
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
L
260  
°C  
ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 5 of this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS (Note 1)  
Parameter  
Symbol  
Value  
8.2  
Unit  
JunctiontoCase Steady State (Note 3)  
JunctiontoAmbient Steady State (Note 3)  
R
°C/W  
q
JC  
R
51.5  
q
JA  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
2. Psi (Y) is used as required per JESD5112 for packages in which  
substantially less than 100% of the heat flows to single case surface.  
2
3. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
4. Continuous DC current rating. Maximum current for pulses as long as 1  
second is higher but is dependent on pulse duration and duty cycle.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
April, 2022 Rev. 2  
NVTFS6H888N/D  
 

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