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NVJD5121NT1G PDF预览

NVJD5121NT1G

更新时间: 2024-11-24 01:16:15
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安森美 - ONSEMI /
页数 文件大小 规格书
6页 75K
描述
Power MOSFET

NVJD5121NT1G 数据手册

 浏览型号NVJD5121NT1G的Datasheet PDF文件第2页浏览型号NVJD5121NT1G的Datasheet PDF文件第3页浏览型号NVJD5121NT1G的Datasheet PDF文件第4页浏览型号NVJD5121NT1G的Datasheet PDF文件第5页浏览型号NVJD5121NT1G的Datasheet PDF文件第6页 
NTJD5121N, NVJD5121N  
Power MOSFET  
60 V, 295 mA, Dual N−Channel with ESD  
Protection, SC−88  
Features  
Low R  
DS(on)  
www.onsemi.com  
Low Gate Threshold  
Low Input Capacitance  
ESD Protected Gate  
NV Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
V
R
MAX  
I Max  
D
(BR)DSS  
DS(on)  
1.6 W @ 10 V  
2.5 W @ 4.5 V  
295 mA  
60 V  
This is a Pb−Free Device  
SC−88 (SOT−363)  
Applications  
S
1
G
1
D
2
1
2
3
6
D
1
Low Side Load Switch  
DC−DC Converters (Buck and Boost Circuits)  
5
G
2
MAXIMUM RATINGS (T = 25°C unless otherwise stated)  
J
Parameter  
Drain−to−Source Voltage  
Symbol  
Value  
60  
Unit  
V
V
DSS  
4
S
2
Gate−to−Source Voltage  
V
GS  
20  
V
Continuous Drain  
Current (Note 1)  
Steady T = 25°C  
I
295  
212  
304  
219  
250  
mA  
A
D
Top View  
State  
T = 85°C  
A
MARKING DIAGRAM &  
PIN ASSIGNMENT  
D1 G2 S2  
t 5 s T = 25°C  
A
T = 85°C  
A
Power Dissipation  
(Note 1)  
Steady T = 25°C  
P
mW  
A
D
6
1
State  
XX M G  
SC−88/SOT−363  
CASE 419B  
STYLE 26  
t 5 s  
266  
900  
G
Pulsed Drain Current  
t = 10 ms  
p
I
mA  
DM  
1
Operating Junction and Storage Temperature  
T , T  
−55 to  
150  
°C  
J
STG  
S1 G1 D2  
= Device Code  
= Date Code  
= Pb−Free Package  
XX  
M
G
Source Current (Body Diode)  
I
S
210  
260  
mA  
Lead Temperature for Soldering Purposes  
(1/8” from case for 10 s)  
°C  
T
L
(Note: Microdot may be in either location)  
Gate−Source ESD Rating (HBM)  
Gate−Source ESD Rating (MM)  
ESD  
2000  
200  
V
V
HBM  
ORDERING INFORMATION  
See detailed ordering and shipping information ion page 5 of  
ESD  
MM  
this data sheet.  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Value  
467  
Unit  
Junction−to−Ambient – Steady State  
Junction−to−Ambient – t 5 s  
Junction−to−Lead – Steady State  
R
°C/W  
q
q
JA  
JA  
R
412  
R
252  
q
JL  
1. Surface mounted on FR4 board using 1 in sq pad size  
(Cu area = 1.127 in sq [2 oz] including traces).  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
July, 2015 − Rev. 9  
NTJD5121N/D  

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