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NVD4C05NT4G

更新时间: 2024-11-13 11:15:51
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
7页 228K
描述
单 N 沟道,功率 MOSFET,30V,90A,4.1mΩ

NVD4C05NT4G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:,Reach Compliance Code:not_compliant
Factory Lead Time:5 weeks风险等级:5.81
Samacsys Description:MOSFET – Power, Single, N-Channel配置:Single
最大漏极电流 (Abs) (ID):61 AFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-609代码:e3湿度敏感等级:1
最高工作温度:175 °C峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):44 W
子类别:FET General Purpose Power表面贴装:YES
端子面层:Tin (Sn)处于峰值回流温度下的最长时间:NOT SPECIFIED

NVD4C05NT4G 数据手册

 浏览型号NVD4C05NT4G的Datasheet PDF文件第2页浏览型号NVD4C05NT4G的Datasheet PDF文件第3页浏览型号NVD4C05NT4G的Datasheet PDF文件第4页浏览型号NVD4C05NT4G的Datasheet PDF文件第5页浏览型号NVD4C05NT4G的Datasheet PDF文件第6页浏览型号NVD4C05NT4G的Datasheet PDF文件第7页 
NVD4C05N  
MOSFET – Power, Single,  
N-Channel  
30 V, 4.1 mW, 90 A  
Features  
Low R  
www.onsemi.com  
to Minimize Conduction Losses  
DS(on)  
Low Q and Capacitance to Minimize Driver Losses  
G
AECQ101 Qualified and PPAP Capable  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
Compliant  
V
R
I
D
(BR)DSS  
DS(on)  
4.1 mW @ 10 V  
6.0 mW @ 4.5 V  
30 V  
90 A  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
D
Parameter  
DraintoSource Voltage  
Symbol  
Value  
30  
Unit  
V
V
DSS  
GatetoSource Voltage  
V
GS  
20  
V
Continuous Drain  
Current R  
T
= 25°C  
= 100°C  
= 25°C  
I
90  
A
C
D
G
q
JC  
T
C
64  
(Notes 1 & 3)  
Steady  
State  
S
Power Dissipation R  
(Note 1)  
T
C
P
57  
W
A
q
D
JC  
JA  
NCHANNEL MOSFET  
T
C
= 100°C  
28  
Continuous Drain  
Current R  
T = 25°C  
A
I
D
22  
4
q
JA  
T = 100°C  
A
16  
(Notes 1, 2 & 3)  
Steady  
State  
2
1
Power Dissipation R  
(Notes 1 & 2)  
T = 25°C  
A
P
3.5  
1.7  
395  
W
q
D
3
T = 100°C  
A
DPAK  
Pulsed Drain Current  
T = 25°C, t = 10 ms  
I
DM  
A
A
p
CASE 369C  
STYLE 2  
Operating Junction and Storage Temperature  
T , T  
55 to  
175  
°C  
J
stg  
Source Current (Body Diode)  
I
75  
A
S
MARKING DIAGRAM  
& PIN ASSIGNMENT  
Single Pulse DraintoSource Avalanche  
E
AS  
133  
mJ  
Energy (T = 25°C, I  
= 6.9 A)  
J
L(pk)  
4
Lead Temperature for Soldering Purposes  
(1/8from case for 10 s)  
T
260  
°C  
Drain  
L
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL RESISTANCE MAXIMUM RATINGS  
2
Drain  
1
3
Parameter  
Symbol  
Value  
2.65  
43  
Unit  
Gate Source  
JunctiontoCase (Drain) (Note 1)  
JunctiontoAmbient Steady State (Note 2)  
R
°C/W  
q
JC  
A
Y
= Assembly Location  
= Year  
R
q
JA  
WW  
= Work Week  
1. The entire application environment impacts the thermal resistance values shown,  
they are not constants and are only valid for the particular conditions noted.  
4C05N = Device Code  
G
2
= PbFree Package  
2. Surfacemounted on FR4 board using a 650 mm , 2 oz. Cu pad.  
3. Maximum current for pulses as long as 1 second is higher but is dependent  
on pulse duration and duty cycle.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2015  
1
Publication Order Number:  
June, 2019 Rev. 1  
NVD4C05N/D  
 

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