NTD5407N, STD5407N,
NVD5407N
Power MOSFET
40 V, 38 A, Single N−Channel, DPAK
Features
• Low R
DS(on)
www.onsemi.com
• High Current Capability
• Low Gate Charge
I
MAX
D
• STD Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable*
V
R
TYP
DS(ON)
(Note 1)
(BR)DSS
40 V
21 mꢂ @ 10 V
38 A
• These Devices are Pb−Free and are RoHS Compliant
N−Channel
Applications
4
D
• Electronic Brake Systems
• Electronic Power Steering
• Bridge Circuits
2
1
3
DPAK
G
CASE 369C
STYLE 2
MAXIMUM RATINGS (T = 25°C unless otherwise stated)
J
Parameter
Drain−to−Source Voltage
Symbol
Value
40
Unit
V
S
V
DSS
MARKING DIAGRAM
Gate−to−Source Voltage
V
GS
20
V
1
Continuous Drain
Current − R
T
= 25°C
= 100°C
= 25°C
I
38
A
C
D
AYWW
54
07NG
Steady
State
ꢀ
JC
T
C
27
Power Dissipation −
R
Steady
State
T
C
P
75
W
A
D
ꢀ
JC
A
Y
= Assembly Location*
= Year
= Work Week
= Specific Device Code
= Pb−Free Device
Continuous Drain
Current R (Note 1)
Steady
State
T = 25°C
A
I
D
7.6
5.3
2.9
WW
5407N
G
ꢀ
JA
T = 100°C
A
Power Dissipation −
(Note 1)
Steady
State
T = 25°C
A
P
W
D
R
ꢀ
JA
* The Assembly Location code (A) is front side
optional. In cases where the Assembly Location is
stamped in the package, the front side assembly
code may be blank.
Pulsed Drain Current
t = 10 ꢁ s
I
75
A
p
DM
Operating Junction and Storage Temperature
T ,
STG
−55 to
175
°C
J
T
Source Current (Body Diode)
I
36
A
S
ORDERING INFORMATION
Single Pulse Drain−to Source Avalanche
EAS
150
mJ
Device
Package
Shipping†
Energy − (V = 50 V, V = 10 V, I = 17 A,
DD
GS
PK
L = 1 mH, R = 25 ꢂ)
G
NTD5407NT4G
DPAK
(Pb−Free)
2500 / Tape &
Reel
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
260
°C
T
L
STD5407NT4G*
NVD5407NT4G*
DPAK
(Pb−Free)
2500 / Tape &
Reel
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
DPAK
(Pb−Free)
2500 / Tape &
Reel
THERMAL RESISTANCE RATINGS (Note 1)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Parameter
Junction−to−Case (Drain)
Junction−to−Ambient (Note 1)
Symbol
Max
2.0
52
Unit
°C/W
°C/W
R
R
θ
JC
JA
θ
1. Surface mounted on FR4 board using 1 sq in pad size,
(Cu Area 1.127 sq in [2 oz] including traces).
© Semiconductor Components Industries, LLC, 2014
1
Publication Order Number:
October, 2016 − Rev. 7
NTD5407N/D