NUS2401SNT1
Integrated PNP/NPN Digital
Transistors Array
This new option of integrated digital transistors is designed to
replace a discrete solution array of three transistors and their external
resistor bias network. BRTs (Bias Resistor Transistors) contain a
single transistor with a monolithic bias network consisting of two
resistors; a series base resistor and a base−emitter resistor. The BRT
technology eliminates these individual components by integrating
them into a single device, therefore the integration of three BRTs
results in a significant reduction of both system cost and board space.
This new device is packaged in the SC−74/Case 318F package which
is designed for low power surface mount applications.
http://onsemi.com
(6)
(5)
(4)
Q3
Features
• Integrated Design
• Reduces Board Space and Components Count
• Simplifies Circuitry Design
Q1
Q2
(1)
(2)
(3)
• Offered in Surface Mount Package Technology (SC−74)
• Available in 3000 Unit Tape and Reel
• Pb−Free Package is Available
MARKING
DIAGRAM
6
Applications
1
SC−74
CASE 318F
STYLE 4
• Audio Muting Applications
50 M G
G
• Drive Circuits Applications
• Industrial: Small Appliances, Security Systems, Automated Test
• Consumer: TVs and VCRs, Stereo Receivers, CD Players,
50
= Specific Device Code
= Date Code
Cassette Recorders
M
G
= Pb−Free Package
MAXIMUM RATINGS (Maximum ratings are those values beyond which
device damage can occur. Electrical Characteristics are not guaranteed over
this range.)
(Note: Microdot may be in either location)
*Date Code orientation may vary depending
upon manufacturing location.
Rating
Symbol
Value
60
Unit
Vdc
ORDERING INFORMATION
Collector−Base Voltage
Collector−Emitter Voltage
Emitter−Base Voltage
V
(BR)CBO
(BR)CEO
(BR)EBO
†
Device
Package
Shipping
V
V
50
Vdc
7.0
Vdc
NUS2401SNT1
SC−74
3000/Tape & Reel
3000/Tape & Reel
Collector Current − Continuous
I
C
200
mAdc
NUS2401SNT1G
SC−74
(Pb−Free)
THERMAL CHARACTERISTICS
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Characteristic
Power Dissipation
Symbol
Max
350
Unit
mW
°C
P
D
Junction Temperature
Storage Temperature
T
J
150
T
stg
−55 to +150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2006
Publication Order Number:
March, 2006 − Rev. 3
NUS2401SNT1/D