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NTD6414AN-1G

更新时间: 2024-11-21 06:00:43
品牌 Logo 应用领域
安森美 - ONSEMI 晶体晶体管功率场效应晶体管脉冲
页数 文件大小 规格书
7页 134K
描述
N-Channel Power MOSFET 100 V, 32 A, 37 mΩ

NTD6414AN-1G 技术参数

是否无铅: 不含铅生命周期:End Of Life
包装说明:IPAK-3针数:4
Reach Compliance Code:not_compliantECCN代码:EAR99
风险等级:5.3Is Samacsys:N
雪崩能效等级(Eas):154 mJ外壳连接:DRAIN
配置:SINGLE WITH BUILT-IN DIODE最小漏源击穿电压:100 V
最大漏极电流 (Abs) (ID):32 A最大漏极电流 (ID):32 A
最大漏源导通电阻:0.037 ΩFET 技术:METAL-OXIDE SEMICONDUCTOR
JESD-30 代码:R-PSIP-T3JESD-609代码:e3
元件数量:1端子数量:3
工作模式:ENHANCEMENT MODE最高工作温度:175 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:IN-LINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL最大功率耗散 (Abs):100 W
最大脉冲漏极电流 (IDM):117 A认证状态:Not Qualified
子类别:FET General Purpose Power表面贴装:NO
端子面层:Tin (Sn)端子形式:THROUGH-HOLE
端子位置:SINGLE处于峰值回流温度下的最长时间:NOT SPECIFIED
晶体管元件材料:SILICONBase Number Matches:1

NTD6414AN-1G 数据手册

 浏览型号NTD6414AN-1G的Datasheet PDF文件第2页浏览型号NTD6414AN-1G的Datasheet PDF文件第3页浏览型号NTD6414AN-1G的Datasheet PDF文件第4页浏览型号NTD6414AN-1G的Datasheet PDF文件第5页浏览型号NTD6414AN-1G的Datasheet PDF文件第6页浏览型号NTD6414AN-1G的Datasheet PDF文件第7页 
NTD6414AN  
N-Channel Power MOSFET  
100 V, 32 A, 37 mW  
Features  
Low R  
DS(on)  
High Current Capability  
100% Avalanche Tested  
http://onsemi.com  
These Devices are PbFree, Halogen Free/BFR Free and are RoHS  
I
D
MAX  
Compliant  
V
R
MAX  
DS(on)  
(Note 1)  
(BR)DSS  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
100 V  
37 mW @ 10 V  
32 A  
Parameter  
DraintoSource Voltage  
GatetoSource Voltage Continuous  
Symbol  
Value  
100  
$20  
32  
Unit  
V
V
DSS  
NChannel  
V
GS  
V
D
Continuous Drain  
Current R  
Steady  
State  
T
= 25°C  
= 100°C  
= 25°C  
I
D
A
C
q
JC  
T
C
22  
Power Dissipation  
R
Steady  
State  
T
C
P
D
100  
W
q
JC  
G
Pulsed Drain Current  
t = 10 ms  
p
I
117  
A
DM  
S
Operating and Storage Temperature Range  
T , T  
55 to  
+175  
°C  
J
stg  
Source Current (Body Diode)  
I
S
32  
A
4
Single Pulse DraintoSource Avalanche  
E
AS  
154  
mJ  
4
Energy (V = 50 Vdc, V = 10 Vdc,  
DD  
GS  
I
= 32 A, L = 0.3 mH, R = 25 W)  
L(pk)  
G
1
2
1
Lead Temperature for Soldering  
Purposes, 1/8from Case for 10 Seconds  
T
L
260  
°C  
2
3
3
DPAK  
IPAK  
CASE 369AA  
STYLE 2  
CASE 369D  
STYLE 2  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Max  
1.5  
37  
Unit  
JunctiontoCase (Drain) Steady State  
JunctiontoAmbient (Note 1)  
R
°C/W  
q
JC  
MARKING DIAGRAM  
& PIN ASSIGNMENTS  
R
q
JA  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Surface mounted on FR4 board using 1 sq in pad size,  
4 Drain  
4 Drain  
(Cu Area 1.127 sq in [1 oz] including traces).  
1
Gate  
3
2
Source  
1
3
Drain  
Gate  
Source  
2
Drain  
6414AN = Device Code  
Y
= Year  
WW  
G
= Work Week  
= PbFree Package  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 5 of this data sheet.  
© Semiconductor Components Industries, LLC, 2009  
1
Publication Order Number:  
November, 2009 Rev. 0  
NTD6414AN/D  
 

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