MBRS260T3
Surface Mount
Schottky Power Rectifier
SMB Power Surface Mount Package
This device employs the Schottky Barrier principle in a
metal−to−siliconpower rectifier. Features epitaxial construction with
oxide passivation and metal overlay contact. Ideally suited for low
voltage, high frequency switching power supplies; free wheeling
diodes and polarity protection diodes.
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 60 VOLTS
Features
• Compact Package with J−Bend Leads Ideal for Automated Handling
• Highly Stable Oxide Passivated Junction
• Guard−Ring for Over−Voltage Protection
• Low Forward Voltage Drop
SMB
CASE 403A
PLASTIC
• Pb−Free Package is Available
Mechanical Characteristics
• Case: Molded Epoxy
MARKING DIAGRAM
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 95 mg (Approximately)
AYWW
B26G
G
• Cathode Polarity Band
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
• ESD Ratings: Machine Model = C
Human Body Model = 3B
B26
A
Y
= Specific Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
WW
G
(Note: Microdot may be in either location)
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
ORDERING INFORMATION
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
V
60
V
RRM
†
Device
Package
Shipping
RWM
V
R
MBRS260T3
SMB
2500/Tape & Reel
2500/Tape & Reel
Average Rectified Forward Current
I
O
2.0
60
A
A
MBRS260T3G
SMB
(At Rated V , T = 95°C)
R
L
(Pb−Free)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
I
FSM
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Storage Temperature Range
Operating Junction Temperature
Voltage Rate of Change
T
stg
−55 to +150
−55 to +125
10,000
°C
°C
T
J
dv/dt
V/ms
(Rated V , T = 25°C)
R
J
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
May, 2010 − Rev. 5
MBRS260T3/D