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NRVBS360BT3G-VF01 PDF预览

NRVBS360BT3G-VF01

更新时间： 2024-11-19 19:48:07
品牌 Logo 应用领域
安森美 - ONSEMI 光电二极管
页数 文件大小 规格书
7页 143K
描述
Rectifier Diode

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中文翻译

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NRVBS360BT3G-VF01 技术参数

是否Rohs认证： 符合生命周期：End Of Life
包装说明：R-PDSO-J2Reach Compliance Code：not_compliant
ECCN代码：EAR99HTS代码：8541.10.00.80
风险等级：5.72其他特性：FREE WHEELING DIODE
应用：POWER配置：SINGLE
二极管元件材料：SILICON二极管类型：RECTIFIER DIODE
最大正向电压 (VF)：0.63 VJESD-30 代码：R-PDSO-J2
JESD-609代码：e3湿度敏感等级：1
最大非重复峰值正向电流：125 A元件数量：1
相数：1端子数量：2
最高工作温度：175 °C最低工作温度：-65 °C
最大输出电流：4 A封装主体材料：PLASTIC/EPOXY
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：NOT SPECIFIED参考标准：AEC-Q101
最大重复峰值反向电压：60 V最大反向电流：30 µA
表面贴装：YES技术：SCHOTTKY
端子面层：Tin (Sn)端子形式：J BEND
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

NRVBS360BT3G-VF01 数据手册

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MBRS360T3G,  
MBRS360BT3G,  
NRVBS360T3G,  
NRVBS360BT3G  
Surface Mount  
Schottky Power Rectifier  
www.onsemi.com  
SCHOTTKY BARRIER  
RECTIFIERS  
3.0 AMPERES, 60 VOLTS  
This device employs the Schottky Barrier principle in a large area  
metal−to−silicon power diode. State−of−the−art geometry features  
epitaxial construction with oxide passivation and metal overlay  
contact. Ideally suited for low voltage, high frequency rectification, or  
as free wheeling and polarity protection diodes, in surface mount  
applications where compact size and weight are critical to the system.  
Features  
SMC 2−LEAD  
CASE 403AC  
SMB  
CASE 403A−03  
• Small Compact Surface Mountable Package with J−Bend Leads  
• Rectangular Package for Automated Handling  
• Highly Stable Oxide Passivated Junction  
• Excellent Ability to Withstand Reverse Avalanche Energy Transients  
• Guard−Ring for Stress Protection  
• NRVBS Prefix for Automotive and Other Applications Requiring  
Unique Site and Control Change Requirements; AEC−Q101  
Qualified and PPAP Capable*  
MARKING DIAGRAMS  
AYWW  
B36G  
G
AYWW  
B36G  
G
B36  
A
Y
= Specific Device Code  
= Assembly Location**  
= Year  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
WW  
G
= Work Week  
= Pb−Free Package  
(Note: Microdot may be in either location)  
Mechanical Characteristics  
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0  
• Weight: 217 mg (Approximately), SMC  
95 mg (Approximately), SMB  
• Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
**The Assembly Location code (A) is front side  
optional. In cases where the Assembly Location is  
stamped in the package, the front side assembly code  
may be blank.  
• Lead and Mounting Surface Temperature for Soldering Purposes:  
ORDERING INFORMATION  
260°C Max. for 10 Seconds  
†
Device  
Package  
Shipping  
• Polarity: Polarity Band on Plastic Body Indicates Cathode Lead  
• Device Meets MSL 1 Requirements  
MBRS360T3G  
SMC  
(Pb−Free)  
2,500 /  
Tape & Reel  
• ESD Ratings:  
MBRS360BT3G  
NRVBS360T3G*  
NRVBS360BT3G*  
SMB  
(Pb−Free)  
2,500 /  
Tape & Reel  
♦ Machine Model, C  
♦ Human Body Model, 3B  
SMC  
(Pb−Free)  
2,500 /  
Tape & Reel  
SMB  
2,500 /  
(Pb−Free)  
Tape & Reel  
NRVBS360BT3G  
−VF01*  
SMB  
(Pb−Free)  
2,500 /  
Tape & Reel  
SBRS360BT3G  
SMB  
(Pb−Free)  
2,500 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
June, 2017 − Rev. 11  
MBRS360T3/D  
1234567

中文翻译

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