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NRVBS330T3G PDF预览

NRVBS330T3G

更新时间： 2024-02-21 14:38:54
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 106K
描述
Surface Mount Schottky Power Rectifier

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中文翻译

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NRVBS330T3G 技术参数

是否无铅： 不含铅生命周期：Active
包装说明：SMC, 2 PIN针数：2
Reach Compliance Code：not_compliantECCN代码：EAR99
Factory Lead Time：4 weeks风险等级：5.62
其他特性：FREE WHEELING DIODE应用：POWER
配置：SINGLE二极管元件材料：SILICON
二极管类型：RECTIFIER DIODE最大正向电压 (VF)：0.5 V
JESD-30 代码：R-PDSO-J2JESD-609代码：e3
湿度敏感等级：1最大非重复峰值正向电流：80 A
元件数量：1相数：1
端子数量：2最高工作温度：150 °C
最低工作温度：-65 °C最大输出电流：4 A
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：NOT SPECIFIED
参考标准：AEC-Q101最大重复峰值反向电压：30 V
最大反向电流：2000 µA子类别：Rectifier Diodes
表面贴装：YES技术：SCHOTTKY
端子面层：Tin (Sn)端子形式：J BEND
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

NRVBS330T3G 数据手册

 浏览型号NRVBS330T3G的Datasheet PDF文件第2页浏览型号NRVBS330T3G的Datasheet PDF文件第3页浏览型号NRVBS330T3G的Datasheet PDF文件第4页 
MBRS320T3G, SBRS8320T3G,  
MBRS330T3G, NRVBS330T3G,  
MBRS340T3G, SBRS8340T3G  
Surface Mount  
Schottky Power Rectifier  
http://onsemi.com  
These devices employ the Schottky Barrier principle in a large area  
metal-to-silicon power diode. State-of-the-art geometry features  
epitaxial construction with oxide passivation and metal overlay  
contact. Ideally suited for low voltage, high frequency rectification, or  
as free wheeling and polarity protection diodes, in surface mount  
applications where compact size and weight are critical to the system.  
SCHOTTKY BARRIER  
RECTIFIERS  
3.0 AMPERES  
20, 30, 40 VOLTS  
Features  
• Small Compact Surface Mountable Package with J-Bend Leads  
• Rectangular Package for Automated Handling  
• Highly Stable Oxide Passivated Junction  
SMC  
CASE 403  
PLASTIC  
• Very Low Forward Voltage Drop  
(0.5 V Max @ 3.0 A, T = 25°C)  
J
MARKING DIAGRAM  
• Excellent Ability to Withstand Reverse Avalanche Energy Transients  
• Guard-Ring for Stress Protection  
• Device Passes ISO 7637 Pulse #1  
• SBRS8 and NRVB Prefix for Automotive and Other Applications  
Requiring Unique Site and Control Change Requirements;  
AEC−Q101 Qualified and PPAP Capable  
AYWW  
B3xG  
G
• These are Pb-Free Packages*  
B3x = Device Code  
x
= 2, 3 or 4  
Mechanical Characteristics  
A
Y
= Assembly Location  
= Year  
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0  
• Weight: 217 mg (Approximately)  
WW = Work Week  
G
= Pb−Free Package  
(Note: Microdot may be in either location)  
• Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
ORDERING INFORMATION  
• Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
†
Device  
Package  
Shipping  
• Polarity: Notch in Plastic Body Indicates Cathode Lead  
MBRS320T3G  
SMC  
(Pb−Free)  
2,500 /  
Tape & Reel  
• Device Meets MSL 1 Requirements  
SBRS8320T3G  
SMC  
(Pb−Free)  
2,500 /  
Tape & Reel  
• ESD Ratings:  
♦ Machine Model = C (> 400 V)  
♦ Human Body Model = 3B (> 8000 V)  
MBRS330T3G  
NRVBS330T3G  
SMC  
(Pb−Free)  
2,500 /  
Tape & Reel  
SMC  
2,500 /  
(Pb−Free)  
Tape & Reel  
MBRS340T3G  
SBRS8340T3G  
SMC  
(Pb−Free)  
2,500 /  
Tape & Reel  
SMC  
(Pb−Free)  
2,500 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specification  
Brochure, BRD8011/D.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
April, 2013 − Rev. 11  
MBRS340T3/D  
1234

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