NDD60N550U1
N-Channel Power MOSFET
600 V, 550 mW
Features
• 100% Avalanche Tested
• These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS
http://onsemi.com
Compliant
V
R
MAX
DS(ON)
(BR)DSS
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)
J
600 V
550 mW @ 10 V
Parameter
Drain−to−Source Voltage
Symbol
NDD
600
25
Unit
V
V
DSS
N−Channel MOSFET
D (2)
Gate−to−Source Voltage
V
GS
V
Continuous Drain
Current R
Steady
State
T
=
I
D
8.2
A
C
25°C
q
JC
T
=
5.2
94
34
C
100°C
G (1)
Power Dissipation –
R
Steady
State
T
C
=
P
W
D
25°C
q
JC
S (3)
Pulsed Drain Current
t = 10 ms
I
A
p
DM
Operating Junction and Storage
Temperature
T ,
STG
−55 to
°C
J
T
+150
4
4
Source Current (Body Diode)
I
S
8.2
54
A
Single Pulse Drain−to−Source Avalanche
EAS
mJ
2
1
1
Energy (I = 4 A)
D
3
2
3
Peak Diode Recovery (Note 1)
dv/dt
15
V/ns
IPAK
DPAK
CASE 369D
STYLE 2
CASE 369C
STYLE 2
Lead Temperature for Soldering Leads
T
260
°C
L
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
4
1. I < 8.2 A, di/dt ≤ 400 A/ms, V
≤ V
, V = 80% V
(BR)DSS DD (BR)DSS
SD
DS peak
1
2
3
IPAK
THERMAL RESISTANCE
Parameter
Symbol
Value
Unit
°C/W
°C/W
CASE 369AD
STYLE 2
Junction−to−Case (Drain)
NDD60N550U1
R
1.3
q
JC
Junction−to−Ambient Steady State
R
q
JA
(Note 3)
(Note 2)
(Note 2)
NDD60N550U1
47
98
95
MARKING AND ORDERING INFORMATION
See detailed ordering and shipping information on page 3 of
this data sheet.
NDD60N550U1−1
NDD60N550U1−35
2. Insertion mounted
3. Surface mounted on FR4 board using 1″ sq. pad size
(Cu area = 1.127 in sq [2 oz] including traces)
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
December, 2013 − Rev. 0
NDD60N550U1/D