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NDDL01N60ZT4G PDF预览

NDDL01N60ZT4G

更新时间: 2024-11-26 11:13:07
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
11页 307K
描述
功率 MOSFET,600V,0.8A,15Ω,单 N 沟道,DPAK

NDDL01N60ZT4G 数据手册

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NDDL01N60Z, NDTL01N60Z  
N-Channel Power MOSFET  
600 V, 15 W  
Features  
100% Avalanche Tested  
Gate Charge Minimized  
http://onsemi.com  
Zener−protected  
These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS  
V
R
MAX  
DS(ON)  
(BR)DSS  
Compliant  
600 V  
15 W @ 10 V  
ABSOLUTE MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
J
Parameter  
Drain−to−Source Voltage  
Gate−to−Source Voltage  
Continuous Drain Current  
Symbol  
NDD  
NDT  
Unit  
V
N−Channel MOSFET  
D (2, 4)  
V
DSS  
600  
30  
V
GS  
V
I
D
0.8  
0.5  
26  
0.25  
0.15  
2
A
Steady State, T = 25°C (Note 1)  
C
Continuous Drain Current  
I
D
A
G (1)  
Steady State, T = 100°C (Note 1)  
C
Power Dissipation  
P
D
W
Steady State, T = 25°C  
C
S (3)  
Pulsed Drain Current, t = 10 ms  
I
3.4  
12  
A
A
p
DM  
Source Current (Body Diode)  
I
S
2.5  
1.7  
4
Single Pulse Drain−to−Source  
EAS  
mJ  
1
Avalanche Energy (I = 0.8 A)  
D
2
3
Peak Diode Recovery (Note 2)  
dv/dt  
4.5  
V/ns  
SOT−223  
CASE 318E  
STYLE 3  
Lead Temperature for Soldering  
Leads  
T
L
260  
°C  
Operating Junction and Storage  
Temperature  
T , T  
−55 to +150  
°C  
J
STG  
4
4
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Limited by maximum junction temperature  
2
1
2
3
1
3
2. I = 1.5 A, di/dt 100 A/ms, V BV  
S
DD  
DSS  
DPAK  
IPAK  
CASE 369C  
STYLE 2  
CASE 369D  
STYLE 2  
THERMAL RESISTANCE  
Parameter  
Symbol  
Value  
Unit  
°C/W  
°C/W  
Junction−to−Case (Drain)  
NDDL1N60Z  
R
4.8  
q
JC  
JA  
MARKING & ORDERING INFORMATION  
See detailed ordering, marking and shipping information in the  
package dimensions section on page 3 of this data sheet.  
Junction−to−Ambient  
(Note 4) NDDL1N60Z  
(Note 3) NDDL1N60Z−1  
(Note 4) NDTL1N60Z  
(Note 5) NDTL1N60Z  
R
42  
96  
62  
q
151  
3. Insertion mounted.  
4. Surface−mounted on FR4 board using 1” sq. pad size  
(Cu area = 1.127” sq. [2 oz] including traces).  
5. Surface−mounted on FR4 board using minimum recommended pad size  
(Cu area = 0.026” sq. [2 oz]).  
© Semiconductor Components Industries, LLC, 2014  
1
Publication Order Number:  
May, 2014 − Rev. 0  
NDDL01N60Z/D  
 

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