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NDC7001C PDF预览

NDC7001C

更新时间: 2024-11-19 11:14:23
品牌 Logo 应用领域
安森美 - ONSEMI PC开关光电二极管晶体管场效应晶体管
页数 文件大小 规格书
10页 359K
描述
双 N 和 P 沟道增强型场效应晶体管,60V

NDC7001C 技术参数

是否无铅:不含铅生命周期:Active
包装说明:SMALL OUTLINE, R-PDSO-G6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.21.00.95
Factory Lead Time:7 weeks风险等级:0.94
Samacsys Confidence:3Samacsys Status:Released
Samacsys PartID:5355Samacsys Pin Count:6
Samacsys Part Category:Integrated CircuitSamacsys Package Category:SOT23 (6-Pin)
Samacsys Footprint Name:SSOT 6LSamacsys Released Date:2015-04-16 09:48:08
Is Samacsys:N配置:SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
最小漏源击穿电压:60 V最大漏极电流 (Abs) (ID):0.51 A
最大漏极电流 (ID):0.51 A最大漏源导通电阻:2 Ω
FET 技术:METAL-OXIDE SEMICONDUCTORJESD-30 代码:R-PDSO-G6
JESD-609代码:e3湿度敏感等级:1
元件数量:2端子数量:6
工作模式:ENHANCEMENT MODE最高工作温度:150 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):NOT SPECIFIED
极性/信道类型:N-CHANNEL AND P-CHANNEL最大功率耗散 (Abs):0.96 W
认证状态:Not Qualified子类别:Other Transistors
表面贴装:YES端子面层:Tin (Sn)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED晶体管应用:SWITCHING
晶体管元件材料:SILICONBase Number Matches:1

NDC7001C 数据手册

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DATA SHEET  
www.onsemi.com  
D2  
Field Effect Transistor -  
Dual, N & P-Channel,  
Enhancement Mode  
S1  
D1  
G2  
S2  
G1  
TSOT23 6Lead  
SUPERSOT6  
CASE 419BL  
NDC7001C  
General Description  
These dual N & PChannel Enhancement Mode Field Effect  
Transistors are produced using onsemi’s proprietary, high cell density,  
DMOS technology. This very high density process has been designed  
to minimize onstate resistance, provide rugged and reliable  
performance and fast switching. These device is particularly suited for  
low voltage, low current, switching, and power supply application.  
MARKING DIAGRAM  
XXX M  
G
1
XXX = Specific Device Code  
Features  
M
= Date Code  
G
= PbFree Package  
Q1 0.51 A, 60 V  
R
R
= 2 W @ V = 10 V  
GS  
DS(ON)  
= 4 W @ V = 4.5 V  
DS(ON)  
GS  
PINOUT  
Q2 –0.34 A, 60 V  
R
R
= 5 W @ V = –10 V  
GS  
DS(ON)  
Q2(P)  
= 7.5 W @ V = –4.5 V  
DS(ON)  
GS  
4
5
6
3
2
1
High Saturation Current  
High Density Cell Design for Low R  
DS(ON)  
Proprietary SUPERSOTt6 Package Design Using Copper Lead  
Frame for Superior Thermal and Electrical Capabilities  
This is a PbFree Device  
Q1(N)  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)  
Symbol  
Parameter  
DrainSource Voltage  
Q1  
60  
20  
Q2  
60  
20  
Unit  
V
V
DSS  
V
GSS  
ORDERING INFORMATION  
GateSource Voltage  
V
See detailed ordering and shipping information on page 8 of  
this data sheet.  
I
D
Drain Current  
Continuous  
(Note 1a)  
0.51 0.34  
A
Pulsed  
1.5 1  
A
W
W
W
°C  
P
D
Power Dissipation for (Note 1a)  
0.96  
0.9  
Single Operation  
(Note 1b)  
(Note 1c)  
0.7  
T , T  
Operating and Storage Temperature  
Range  
55 to +150  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Ratings  
Unit  
RqJA  
Thermal Resistance,  
Junction to Ambient (Note 1a)  
130  
°C/W  
RqJC  
Thermal Resistance,  
Junction to Case (Note 1)  
60  
°C/W  
© Semiconductor Components Industries, LLC, 2002  
1
Publication Order Number:  
December, 2021 Rev. 2  
NDC7001C/D  

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漏源电压(Vdss):50V;持续漏极电流(Id)(在25°C时):0.51A;栅极-源极