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MURD620CT_06 PDF预览

MURD620CT_06

更新时间: 2024-09-29 04:13:59
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
4页 54K
描述
ULTRAFAST RECTIFIER 6.0 AMPERES 200 VOLTS

MURD620CT_06 数据手册

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MURD620CT  
Preferred Device  
SWITCHMODEt  
Power Rectifier  
DPAK Surface Mount Package  
These state−of−the−art devices are designed for use in switching  
power supplies, inverters and as free wheeling diodes.  
http://onsemi.com  
Features  
ULTRAFAST RECTIFIER  
6.0 AMPERES  
Ultrafast 35 Nanosecond Recovery Time  
Low Forward Voltage Drop  
Low Leakage  
200 VOLTS  
Pb−Free Packages are Available  
Mechanical Characteristics:  
1
4
3
Case: Epoxy, Molded  
Weight: 0.4 Gram (Approximately)  
Finish: All External Surfaces Corrosion Resistant and Terminal  
Leads are Readily Solderable  
MARKING  
DIAGRAM  
Lead and Mounting Surface Temperature for Soldering Purposes:  
260°C Max. for 10 Seconds  
4
MAXIMUM RATINGS  
YWW  
U
620TG  
Rating  
Symbol  
Value  
Unit  
DPAK  
CASE 369C  
2
1
Peak Repetitive Reverse Voltage  
Working Peak Reverse Voltage  
DC Blocking Voltage  
V
200  
V
3
RRM  
V
RWM  
V
R
Average Rectified Forward Current  
I
A
A
F(AV)  
Y
= Year  
= Work Week  
(Rated V , T = 140°C)  
Per Diode  
Per Device  
3.0  
6.0  
R
C
WW  
U620T = Device Code  
= Pb−Free Package  
Peak Repetitive Forward Current  
I
6.0  
F
G
(Rated V , Square Wave,  
R
20 kHz, T = 145°C)  
Per Diode  
C
Non−Repetitive Peak Surge Current  
(Surge Applied at Rated Load Conditions  
Halfwave, 60 Hz)  
I
50  
A
FSM  
ORDERING INFORMATION  
Device  
Package  
Shipping  
Operating Junction and Storage  
Temperature Range  
T , T  
−65 to +175  
°C  
J
stg  
MURD620CT  
DPAK  
75 Units/Rail  
75 Units/Rail  
MURD620CTG  
DPAK  
(Pb−Free)  
THERMAL CHARACTERISTICS (Per Diode)  
Rating  
Symbol  
Value  
Unit  
MURD620CTT4  
DPAK  
2500/Tape & Reel  
2500/Tape & Reel  
Thermal Resistance, Junction−to−Case  
R
9
°C/W  
q
JC  
JA  
Thermal Resistance, Junction−to−Ambient  
(Note 1)  
R
80  
°C/W  
MURD620CTT4G  
DPAK  
(Pb−Free)  
q
Maximum ratings are those values beyond which device damage can occur.  
Maximum ratings applied to the device are individual stress limit values (not  
normal operating conditions) and are not valid simultaneously. If these limits are  
exceeded, device functional operation is not implied, damage may occur and  
reliability may be affected.  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
1. Rating applies when surface mounted on the minimum pad sizes  
recommended.  
Preferred devices are recommended choices for future use  
and best overall value.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
February, 2006 − Rev. 6  
MURD620CT/D  
 

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