MURD620CT
Preferred Device
SWITCHMODEt
Power Rectifier
DPAK Surface Mount Package
These state−of−the−art devices are designed for use in switching
power supplies, inverters and as free wheeling diodes.
http://onsemi.com
Features
ULTRAFAST RECTIFIER
6.0 AMPERES
• Ultrafast 35 Nanosecond Recovery Time
• Low Forward Voltage Drop
• Low Leakage
200 VOLTS
• Pb−Free Packages are Available
Mechanical Characteristics:
1
4
3
• Case: Epoxy, Molded
• Weight: 0.4 Gram (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
MARKING
DIAGRAM
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Max. for 10 Seconds
4
MAXIMUM RATINGS
YWW
U
620TG
Rating
Symbol
Value
Unit
DPAK
CASE 369C
2
1
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
200
V
3
RRM
V
RWM
V
R
Average Rectified Forward Current
I
A
A
F(AV)
Y
= Year
= Work Week
(Rated V , T = 140°C)
Per Diode
Per Device
3.0
6.0
R
C
WW
U620T = Device Code
= Pb−Free Package
Peak Repetitive Forward Current
I
6.0
F
G
(Rated V , Square Wave,
R
20 kHz, T = 145°C)
Per Diode
C
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, 60 Hz)
I
50
A
FSM
ORDERING INFORMATION
†
Device
Package
Shipping
Operating Junction and Storage
Temperature Range
T , T
−65 to +175
°C
J
stg
MURD620CT
DPAK
75 Units/Rail
75 Units/Rail
MURD620CTG
DPAK
(Pb−Free)
THERMAL CHARACTERISTICS (Per Diode)
Rating
Symbol
Value
Unit
MURD620CTT4
DPAK
2500/Tape & Reel
2500/Tape & Reel
Thermal Resistance, Junction−to−Case
R
9
°C/W
q
JC
JA
Thermal Resistance, Junction−to−Ambient
(Note 1)
R
80
°C/W
MURD620CTT4G
DPAK
(Pb−Free)
q
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
1. Rating applies when surface mounted on the minimum pad sizes
recommended.
Preferred devices are recommended choices for future use
and best overall value.
©
Semiconductor Components Industries, LLC, 2006
1
Publication Order Number:
February, 2006 − Rev. 6
MURD620CT/D