18Mb: 1 MEG x 18, 512K x 32/36
PIPELINED, SCD SYNCBURST SRAM
MT58L1MY18P, MT58V1MV18P,
MT58L512Y32P, MT58V512V32P,
18Mb SYNCBURST™
SRAM
MT58L512Y36P, MT58V512V36P
3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD, 2.5V I/O
Features
Figure 1: 100-Pin TQFP
JEDEC-Standard MS-026 BHA (LQFP)
•
•
Fast clock and OE# access times
Single 3.3V ±± percent or 2.±V ±± percent power
supply
•
Separate 3.3V ±± percent or 2.±V ±± percent isolated
output buffer supply (VDDQ)
•
•
SNOOZE MODE for reduced-power standby
Single-cycle deselect (Pentium® BSRAM-
compatible)
•
•
•
Common data inputs and data outputs
Individual byte write control and global write
Three chip enables for simple depth expansion and
address pipelining
•
Clock-controlled and registered addresses, data
I/Os, and control signals
•
•
•
Internally self-timed WRITE cycle
Burst control (interleaved or linear burst)
Low capacitive bus loading
Figure 2: 165-Ball FBGA
JEDEC-Standard MS-216 (Var. CAB-1)
TQFP
Options
Marking
•
Timing (Access/Cycle/MHz)
3.1ns/±ns/200 MHz
3.±ns/6ns/166 MHz
4.2ns/7.±ns/133 MHz
±ns/10ns/100 MHz
Configurations
3.3V VDD, 3.3V or 2.±V I/O
1 Meg x 18
-±
-6
-7.±
-10
•
MT±8L1MY18P
MT±8L±12Y32P
MT±8L±12Y36P
±12K x 32
±12K x 36
Part Number Example:
2.±V VDD, 2.±V I/O
1 Meg x 18
±12K x 32
±12K x 36
Packages
MT58L512Y36PT-10
MT±8V1MV18P
MT±8V±12V32P
MT±8V±12V36P
General Description
The Micron® SyncBurst™ SRAM family employs
high-speed, low-power CMOS designs that are fabri-
cated using an advanced CMOS process.
•
•
100-pin TQFP
T
16±-ball, 13mm x 1±mm FBGA
Operating Temperature Range
Commercial (0ºC ? TA ? +70ºC)
F1
Micron’s 18Mb SyncBurst SRAMs integrate a 1 Meg x
18, ±12K x 32, or ±12K x 36 SRAM core with advanced
synchronous peripheral circuitry and a 2-bit burst
counter. All synchronous inputs pass through registers
controlled by a positive-edge-triggered single-clock
input (CLK). The synchronous inputs include all
addresses, all data inputs, active LOW chip enable
(CE#), two additional chip enables for easy depth
expansion (CE2, CE2#), burst control inputs (ADSC#,
None
IT2
Industrial (-40ºC ? TA ? +8±ºC)
NOTE:
1. A Part Marking Guide for the FBGA devices can be found on
Micron’s Web site—http://www.micron.com/numberguide.
2. Contact factory for availability of Industrial Temperature
devices.
18Mb: 1 Meg x 18, 512K x 32/36, Pipelined, SCD SyncBurst SRAM
MT58L1MY18P1_16_D.fm – Rev. D, Pub 2/03
©2003 Micron Technology, Inc.
1
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.