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MT58V1MV18PF-6 PDF预览

MT58V1MV18PF-6

更新时间: 2024-11-08 04:52:51
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 静态存储器
页数 文件大小 规格书
34页 535K
描述
Cache SRAM, 1MX18, 3.5ns, CMOS, PBGA165, 13 X 15 MM, FBGA-165

MT58V1MV18PF-6 数据手册

 浏览型号MT58V1MV18PF-6的Datasheet PDF文件第2页浏览型号MT58V1MV18PF-6的Datasheet PDF文件第3页浏览型号MT58V1MV18PF-6的Datasheet PDF文件第4页浏览型号MT58V1MV18PF-6的Datasheet PDF文件第5页浏览型号MT58V1MV18PF-6的Datasheet PDF文件第6页浏览型号MT58V1MV18PF-6的Datasheet PDF文件第7页 
18Mb: 1 MEG x 18, 512K x 32/36  
PIPELINED, SCD SYNCBURST SRAM  
MT58L1MY18P, MT58V1MV18P,  
MT58L512Y32P, MT58V512V32P,  
18Mb SYNCBURST™  
SRAM  
MT58L512Y36P, MT58V512V36P  
3.3V VDD, 3.3V or 2.5V I/O; 2.5V VDD, 2.5V I/O  
Features  
Figure 1: 100-Pin TQFP  
JEDEC-Standard MS-026 BHA (LQFP)  
Fast clock and OE# access times  
Single 3.3V ±± percent or 2.±V ±± percent power  
supply  
Separate 3.3V ±± percent or 2.±V ±± percent isolated  
output buffer supply (VDDQ)  
SNOOZE MODE for reduced-power standby  
Single-cycle deselect (Pentium® BSRAM-  
compatible)  
Common data inputs and data outputs  
Individual byte write control and global write  
Three chip enables for simple depth expansion and  
address pipelining  
Clock-controlled and registered addresses, data  
I/Os, and control signals  
Internally self-timed WRITE cycle  
Burst control (interleaved or linear burst)  
Low capacitive bus loading  
Figure 2: 165-Ball FBGA  
JEDEC-Standard MS-216 (Var. CAB-1)  
TQFP  
Options  
Marking  
Timing (Access/Cycle/MHz)  
3.1ns/±ns/200 MHz  
3.±ns/6ns/166 MHz  
4.2ns/7.±ns/133 MHz  
±ns/10ns/100 MHz  
Configurations  
3.3V VDD, 3.3V or 2.±V I/O  
1 Meg x 18  
-±  
-6  
-7.±  
-10  
MT±8L1MY18P  
MT±8L±12Y32P  
MT±8L±12Y36P  
±12K x 32  
±12K x 36  
Part Number Example:  
2.±V VDD, 2.±V I/O  
1 Meg x 18  
±12K x 32  
±12K x 36  
Packages  
MT58L512Y36PT-10  
MT±8V1MV18P  
MT±8V±12V32P  
MT±8V±12V36P  
General Description  
The Micron® SyncBurst™ SRAM family employs  
high-speed, low-power CMOS designs that are fabri-  
cated using an advanced CMOS process.  
100-pin TQFP  
T
16±-ball, 13mm x 1±mm FBGA  
Operating Temperature Range  
Commercial (0ºC ? TA ? +70ºC)  
F1  
Microns 18Mb SyncBurst SRAMs integrate a 1 Meg x  
18, ±12K x 32, or ±12K x 36 SRAM core with advanced  
synchronous peripheral circuitry and a 2-bit burst  
counter. All synchronous inputs pass through registers  
controlled by a positive-edge-triggered single-clock  
input (CLK). The synchronous inputs include all  
addresses, all data inputs, active LOW chip enable  
(CE#), two additional chip enables for easy depth  
expansion (CE2, CE2#), burst control inputs (ADSC#,  
None  
IT2  
Industrial (-40ºC ? TA ? +8±ºC)  
NOTE:  
1. A Part Marking Guide for the FBGA devices can be found on  
Micron’s Web site—http://www.micron.com/numberguide.  
2. Contact factory for availability of Industrial Temperature  
devices.  
18Mb: 1 Meg x 18, 512K x 32/36, Pipelined, SCD SyncBurst SRAM  
MT58L1MY18P1_16_D.fm – Rev. D, Pub 2/03  
©2003 Micron Technology, Inc.  
1
PRODUCTS AND SPECIFICATIONS DISCUSSED HEREIN ARE SUBJECT TO CHANGE BY MICRON WITHOUT NOTICE.  

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