MPSA18

更新时间： 2024-01-29 02:16:03

品牌	Logo	应用领域
安森美 - ONSEMI		晶体晶体管
页数	文件大小	规格书
5页	81K
描述
Low Noise Transistor NPN Silicon

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MPSA18 数据手册

MPSA18

Preferred Device

Low Noise Transistor

NPN Silicon

Features

• These are Pb−Free Devices*

http://onsemi.com

COLLECTOR

MAXIMUM RATINGS

Rating

Collector−Emitter Voltage

Collector−Base Voltage

Emitter−Base Voltage

Symbol

Value

Unit

Vdc

BASE

CEO

CBO

EBO

EMITTER

Vdc

6.5

Vdc

Collector Current − Continuous

200

mAdc

TO−92

CASE 29

STYLE 1

Total Device Dissipation @ T = 25°C

625

5.0

mW/°C

Derate above 25°C

Total Device Dissipation @ T = 25°C

1.5

mW/°C

Derate above 25°C

Operating and Storage Junction

Temperature Range

T , T

−55 to +150

°C

stg

STRAIGHT LEAD

BULK PACK

BENT LEAD

TAPE & REEL

AMMO PACK

THERMAL CHARACTERISTICS

Characteristic

Symbol

Max

Unit

MARKING DIAGRAM

Thermal Resistance, Junction−to−Ambient

(Note 1)

200

°C/W

Thermal Resistance, Junction−to−Case

83.3

°C/W

MPS

A18

Maximum ratings are those values beyond which device damage can occur.

Maximum ratings applied to the device are individual stress limit values (not

normal operating conditions) and are not valid simultaneously. If these limits are

exceeded, device functional operation is not implied, damage may occur and

reliability may be affected.

AYWW G

1. R

is measured with the device soldered into a typical printed circuit board.

= Assembly Location

= Year

WW = Work Week

= Pb−Free Package

(Note: Microdot may be in either location)

ORDERING INFORMATION

†

Device

Package

Shipping

MPSA18G

TO−92

5000 Units / Bulk

2000/Tape & Reel

(Pb−Free)

MPSA18RLRAG

MPSA18RLRMG

TO−92

(Pb−Free)

TO−92

(Pb−Free)

2000/Ammo Pack

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Preferred devices are recommended choices for future use

and best overall value.

Publication Order Number:

April, 2007 − Rev. 4

MPSA18/D

12 3 4 5

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