Datasheet > MPC860SRZQ80D4

MPC860SRZQ80D4

更新时间： 2022-04-23 23:00:11

阅读下载

获取价格

如果您发现信息不准确，欢迎纠错

MPC860SRZQ80D4 数据手册

Thermal Calculation and Measurement

printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks

where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most

packages, a better model is required.

7.3 Estimation with Junction-to-Board Thermal Resistance

A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor model

consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance

covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the

package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is

conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages,

especially PBGA packages, is strongly dependent on the board temperature; see Figure 1.

Board Temperature Rise Above Ambient Divided by Package Power

Figure 1. Effect of Board Temperature Rise on Thermal Behavior

If the board temperature is known, an estimate of the junction temperature in the environment can be made using

the following equation:

T = T + (R

× P )

θJB

where:

= junction-to-board thermal resistance (ºC/W)

θJB

T = board temperature (ºC)

P = power dissipation in package

If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable

predictions of junction temperature can be made. For this method to work, the board and board mounting must be

similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a

power and a ground plane) and by attaching the thermal balls to the ground plane.

MPC860 Family Hardware Specifications, Rev. 7

Freescale Semiconductor

1...7 8 91011 12 13...80

下载PDF

型号	品牌	描述	获取价格	数据表
MPC860T	FREESCALE	Hardware Specifications	获取价格
MPC860T	MOTOROLA	Family Hardware Specifications	获取价格
MPC860TCVR50D4	NXP	PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, -40 to 95C	获取价格
MPC860TCVR66D4	NXP	PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C	获取价格
MPC860TCZQ50D4	FREESCALE	Hardware Specifications	获取价格
MPC860TCZQ50D4	ROCHESTER	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	获取价格