是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 零件包装代码: | BGA |
包装说明: | 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 | 针数: | 357 |
Reach Compliance Code: | unknown | 风险等级: | 5.72 |
Is Samacsys: | N | 地址总线宽度: | 32 |
位大小: | 32 | 边界扫描: | YES |
最大时钟频率: | 50 MHz | 外部数据总线宽度: | 32 |
格式: | FIXED POINT | 集成缓存: | YES |
JESD-30 代码: | S-PBGA-B357 | JESD-609代码: | e0 |
长度: | 25 mm | 低功率模式: | YES |
湿度敏感等级: | 3 | 端子数量: | 357 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 245 | 认证状态: | COMMERCIAL |
座面最大高度: | 2.52 mm | 速度: | 50 MHz |
最大供电电压: | 3.465 V | 最小供电电压: | 3.135 V |
标称供电电压: | 3.3 V | 表面贴装: | YES |
端子面层: | TIN LEAD | 端子形式: | BALL |
端子节距: | 1.27 mm | 端子位置: | BOTTOM |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 25 mm |
uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
MPC860TCZQ66D4 | ROCHESTER | 32-BIT, 66MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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MPC860TCZQ66D4 | NXP | PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C |
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MPC860TCZQ66D4 | FREESCALE | Hardware Specifications |
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MPC860TVR50D4 | NXP | PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, 0 to 95C |
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MPC860TVR66D4 | NXP | PowerQUICC, 32 Bit Power Architecture, 6MHz, Communications Processor, 0 to 95C |
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MPC860TVR80D4 | ROCHESTER | 32-BIT, 80MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
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