Datasheet > MPC860SRZQ80D4

MPC860SRZQ80D4

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
飞思卡尔 - FREESCALE		/
页数	文件大小	规格书
80页	2125K
描述
Hardware Specifications

阅读下载

获取价格

数据手册

如果您发现信息不准确，欢迎纠错

MPC860SRZQ80D4 数据手册

Power Dissipation

Table 4. MPC860 Thermal Resistance Data

ZQ / VR

Unit

Rating

Environment

Symbol

MPC860P MPC860P

Mold Compound Thickness

0.85

1.15

Junction-to-ambient

Natural convection

Single-layer board (1s)

R_θJA

°C/W

Four-layer board (2s2p)

Single-layer board (1s)

Four-layer board (2s2p)

R_θJMA

Airflow (200 ft/min)

R_θJMA

Junction-to-board

R_θJB

R_θJC

Ψ_JT

Junction-to-case

Junction-to-package top Natural convection

Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)

temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal

resistance.

Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.

Per JEDEC JESD51-6 with the board horizontal.

Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured

on the top surface of the board near the package.

Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate

method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature. For exposed pad

packages where the pad would be expected to be soldered, junction-to-case thermal resistance is a simulated value from

the junction to the exposed pad without contact resistance.

Thermal characterization parameter indicating the temperature difference between the package top and the junction

temperature per JEDEC JESD51-2.

5 Power Dissipation

Table 5 provides power dissipation information. The modes are 1:1, where CPU and bus speeds are equal, and 2:1,

where CPU frequency is twice the bus speed.

Table 5. Power Dissipation (P_D)

Die Revision

Frequency (MHz) Typical

Maximum

Unit

D.4

656

TBD

722

851

735

TBD

762

909

(1:1 mode)

D.4

(2:1 mode)

Typical power dissipation is measured at 3.3 V.

Maximum power dissipation is measured at 3.5 V.

NOTE

-based power dissipation and do not include I/O

Values in Table 5 represent V

DDL

power dissipation over V

. I/O power dissipation varies widely by application

DDH

due to buffer current, depending on external circuitry.

MPC860 Family Hardware Specifications, Rev. 7

Freescale Semiconductor

1...4 5 678 9 10...80

下载PDF

与MPC860SRZQ80D4相关器件

型号	品牌	描述	获取价格	数据表
MPC860T	FREESCALE	Hardware Specifications	获取价格
MPC860T	MOTOROLA	Family Hardware Specifications	获取价格
MPC860TCVR50D4	NXP	PowerQUICC, 32 Bit Power Architecture, 50MHz, Communications Processor, -40 to 95C	获取价格
MPC860TCVR66D4	NXP	PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C	获取价格
MPC860TCZQ50D4	FREESCALE	Hardware Specifications	获取价格
MPC860TCZQ50D4	ROCHESTER	32-BIT, 50MHz, RISC PROCESSOR, PBGA357, 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357	获取价格