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MMSZXXXT1G PDF预览

MMSZXXXT1G

更新时间： 2024-09-15 11:58:43

品牌	Logo	应用领域
安森美 - ONSEMI		稳压器
页数	文件大小	规格书
6页	174K
描述
Zener Voltage Regulators

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中文翻译

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MMSZxxxT1G Series,

SZMMSZxxxT1G Series

Zener Voltage Regulators

500 mW SOD−123 Surface Mount

Three complete series of Zener diodes are offered in the convenient,

surface mount plastic SOD−123 package. These devices provide a

convenient alternative to the leadless 34−package style.

http://onsemi.com

Features

 500 mW Rating on FR−4 or FR−5 Board

 Wide Zener Reverse Voltage Range − 2.4 V to 56 V

 Package Designed for Optimal Automated Board Assembly

 Small Package Size for High Density Applications

 ESD Rating of Class 3 (> 16 kV) per Human Body Model

 AEC−Q101 Qualified and PPAP Capable

 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

SOD−123

CASE 425

STYLE 1

1

2

Cathode

Anode

 Pb−Free Packages are Available*

MARKING DIAGRAM

Mechanical Characteristics

CASE: Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily Solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260C for 10 Seconds

xx M G

1

G

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

xx = Device Code

M

= Date Code

G

= Pb−Free Package

MAXIMUM RATINGS

(Note: Microdot may be in either location)

Rating

Symbol

Max

Unit

ORDERING INFORMATION

Total Power Dissipation on FR−5 Board,

P

D

(Note 1) @ T = 75C

500

6.7

mW

mW/C

L

†

Device

Package

Shipping

Derated above 75C

MMSZxxxT1G

SOD−123

(Pb−Free)

3,000 /

Tape & Reel

Thermal Resistance, Junction−to−Ambient

R

340

C/W

C/W

C

q

JA

(Note 2)

SZMMSZxxxT1G SOD−123

(Pb−Free)

3,000 /

Tape & Reel

Thermal Resistance, Junction−to−Lead

(Note 2)

R

JL

150

q

MMSZxxxT3G

SOD−123

(Pb−Free)

10,000 /

Tape & Reel

Junction and Storage Temperature Range T , T

−55 to +150

J

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 3.5 X 1.5 inches.

SZMMSZxxxT3G SOD−123

(Pb−Free)

10,000 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

2. Thermal Resistance measurement obtained via infrared Scan Method.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 2 of

this data sheet.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012

1

Publication Order Number:

January, 2012 − Rev. 11

MMSZ2V4T1/D

12 3 4 5 6

中文翻译

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