是否Rohs认证: | 不符合 | 生命周期: | Transferred |
包装说明: | CERAMIC, QUAD-84 | Reach Compliance Code: | unknown |
风险等级: | 5.83 | Is Samacsys: | N |
最长访问时间: | 25 ns | I/O 类型: | COMMON |
JESD-30 代码: | S-GQCC-J84 | JESD-609代码: | e0 |
内存密度: | 131072 bit | 内存集成电路类型: | DUAL-PORT SRAM |
内存宽度: | 16 | 功能数量: | 1 |
端口数量: | 2 | 端子数量: | 84 |
字数: | 8192 words | 字数代码: | 8000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 8KX16 |
输出特性: | 3-STATE | 封装主体材料: | CERAMIC, GLASS-SEALED |
封装代码: | QCCJ | 封装等效代码: | LDCC84,1.2SQ |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER |
并行/串行: | PARALLEL | 电源: | 5 V |
认证状态: | Not Qualified | 最大待机电流: | 0.0004 A |
最小待机电流: | 2 V | 子类别: | SRAMs |
最大压摆率: | 0.37 mA | 最大供电电压 (Vsup): | 5.5 V |
最小供电电压 (Vsup): | 4.5 V | 标称供电电压 (Vsup): | 5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | MILITARY | 端子面层: | Tin/Lead (Sn/Pb) |
端子形式: | J BEND | 端子节距: | 1.27 mm |
端子位置: | QUAD | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MMQR-67025L-25/883 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 25ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR67025L25CB | TEMIC |
获取价格 |
Memory IC, | |
MMQR-67025L-35 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 35ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR67025L35CB | TEMIC |
获取价格 |
Memory IC, | |
MMQR-67025L-45 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 45ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR-67025L-45/883 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 45ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR67025L45CB | TEMIC |
获取价格 |
Memory IC, | |
MMQR-67025L-55 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 55ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR-67025L-55/883 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 55ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR67025L55CB | TEMIC |
获取价格 |
Memory IC, |