是否Rohs认证: | 不符合 | 生命周期: | Transferred |
Reach Compliance Code: | unknown | 风险等级: | 5.85 |
Is Samacsys: | N | 最长访问时间: | 45 ns |
I/O 类型: | COMMON | JESD-30 代码: | S-XQCC-J84 |
JESD-609代码: | e0 | 内存密度: | 65536 bit |
内存集成电路类型: | MULTI-PORT SRAM | 内存宽度: | 16 |
端口数量: | 2 | 端子数量: | 84 |
字数: | 4096 words | 字数代码: | 4000 |
工作模式: | ASYNCHRONOUS | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 组织: | 4KX16 |
输出特性: | 3-STATE | 封装主体材料: | CERAMIC |
封装代码: | QCCJ | 封装等效代码: | LDCC84,1.2SQ |
封装形状: | SQUARE | 封装形式: | CHIP CARRIER |
并行/串行: | PARALLEL | 电源: | 5 V |
认证状态: | Not Qualified | 筛选级别: | 38535Q/M;38534H;883B |
最大待机电流: | 0.00004 A | 最小待机电流: | 2 V |
子类别: | SRAMs | 最大压摆率: | 0.32 mA |
标称供电电压 (Vsup): | 5 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | MILITARY |
端子面层: | Tin/Lead (Sn/Pb) | 端子形式: | J BEND |
端子节距: | 1.27 mm | 端子位置: | QUAD |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
MMQR-67024V-55/883 | TEMIC |
获取价格 |
Multi-Port SRAM, 4KX16, 55ns, CMOS, CQCC84, | |
MMQR-67025L-25 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 25ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR-67025L-25/883 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 25ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR67025L25CB | TEMIC |
获取价格 |
Memory IC, | |
MMQR-67025L-35 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 35ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR67025L35CB | TEMIC |
获取价格 |
Memory IC, | |
MMQR-67025L-45 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 45ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR-67025L-45/883 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 45ns, CMOS, CQCC84, CERAMIC, QUAD-84 | |
MMQR67025L45CB | TEMIC |
获取价格 |
Memory IC, | |
MMQR-67025L-55 | TEMIC |
获取价格 |
Dual-Port SRAM, 8KX16, 55ns, CMOS, CQCC84, CERAMIC, QUAD-84 |