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MMQA5V6T3 PDF预览

MMQA5V6T3

更新时间: 2024-11-01 22:25:39
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 70K
描述
SC-74 Quad Monolithic Common Anode

MMQA5V6T3 数据手册

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MMQA Quad Common  
Anode Series  
Preferred Devices  
SC−74 Quad Monolithic  
Common Anode  
Transient Voltage Suppressors  
for ESD Protection  
http://onsemi.com  
This quad monolithic silicon voltage suppressor is designed for  
applications requiring transient overvoltage protection capability. It is  
intended for use in voltage and ESD sensitive equipment such as  
computers, printers, business machines, communication systems,  
medical equipment, and other applications. Its quad junction common  
anode design protects four separate lines using only one package.  
These devices are ideal for situations where board space is at a  
premium.  
SC−74 QUAD TRANSIENT  
VOLTAGE SUPPRESSOR  
24 WATTS PEAK POWER  
5.6 − 33 VOLTS  
Specification Features:  
PIN ASSIGNMENT  
SC−74 Package Allows Four Separate Unidirectional Configurations  
Peak Power − Min. 24 W @ 1.0 ms (Unidirectional),  
1
2
3
6
5
4
per Figure 5 Waveform  
Peak Power − Min. 150 W @ 20 ms (Unidirectional),  
per Figure 6 Waveform  
Maximum Clamping Voltage @ Peak Pulse Current  
6
1
Low Leakage < 2.0 mA  
SC−74  
PLASTIC  
CASE 318F  
PIN 1. CATHODE  
2. ANODE  
ESD Rating of Class N (exceeding 16 kV) per the  
3. CATHODE  
4. CATHODE  
5. ANODE  
Human Body Model  
Pb−Free Packages are Available  
6. CATHODE  
THERMAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
A
Characteristic  
Symbol Value  
Unit  
MARKING DIAGRAM  
Peak Power Dissipation @ 1.0 ms (Note 1)  
P
pk  
24  
W
@ T 25°C  
A
Peak Power Dissipation @ 20 ms (Note 2) @  
P
pk  
150  
W
xxx  
T
25°C  
A
Total Power Dissipation on FR-5 Board  
°P °  
D
°225  
1.8  
°mW°  
mW/°C  
(Note 3) @ T = 25°C  
A
xxx = Device Code  
Thermal Resistance from Junction−to−Ambi-  
ent  
R
556  
°C/W  
q
JA  
M
= Date Code  
Total Power Dissipation on Alumina Sub-  
°P °  
D
°300  
2.4  
°mW  
mW/°C  
strate (Note 4) @ T = 25°C  
A
ORDERING INFORMATION  
Derate above 25°C  
See detailed ordering and shipping information in the table on  
page 5 of this data sheet.  
Thermal Resistance from Junction−to−Ambi-  
ent  
R
417  
°C/W  
°C  
q
JA  
Junction and Storage Temperature Range  
T , T  
J
°− 55 to  
+150°  
stg  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking table  
on page 5 of this data sheet.  
Lead Solder Temperature − Maximum (10  
Second Duration)  
T
L
260  
°C  
Preferred devices are recommended choices for future use  
and best overall value.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
April, 2004 − Rev. 4  
MMQA/D  

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