MMJT9410
Bipolar Power Transistors
NPN Silicon
Features
• SOT−223 Surface Mount Packaging
http://onsemi.com
• Epoxy Meets UL 94 V−0 @ 0.125 in
• These Devices are Pb−Free and are RoHS Compliant
POWER BJT
IC = 3.0 AMPERES
BVCEO = 30 VOLTS
MAXIMUM RATINGS
Rating
Collector−Emitter Voltage
Collector−Base Voltage
Symbol Value
Unit
Vdc
Vdc
Vdc
Adc
Adc
Adc
V
30
45
CEO
V
CE(sat) = 0.2 VOLTS
V
CB
EB
Emitter−Base Voltage
V
6.0
1.0
3.0
5.0
Base Current − Continuous
Collector Current − Continuous
Collector Current − Peak
I
B
4
C 2,4
I
C
C
I
CM
Total Power Dissipation @ T = 25°C
P
D
3.0
24
W
mW/°C
W
C
Derate above 25°C
B
1
C
2
E
3
Total P @ T = 25°C mounted on 1” sq.
1.7
D
A
(645 sq. mm) Collector pad on FR−4
B 1
E 3
Top View
Pinout
bd material
Schematic
Total P @ T = 25°C mounted on 0.012” sq.
0.75
D
A
(7.6 sq. mm) Collector pad on FR−4 bd material
Operating and Storage Junction
Temperature Range
T
T
−55 to
°C
J, stg
+150
MARKING
DIAGRAM
4
ESD − Human Body Model
ESD − Machine Model
HBM
MM
3B
C
V
V
1
2
3
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
AYW
9410G
G
SOT−223
CASE 318E
STYLE 1
1
THERMAL CHARACTERISTICS
A
Y
W
= Assembly Location
= Year
= Work Week
Characteristic
Symbol
Max
42
Unit
°C/W
°C/W
Thermal Resistance, Junction−to−Case
R
q
JC
Thermal Resistance, Junction−to−Ambient on
1” sq. (645 sq. mm) Collector pad on FR−4 bd
material
R
75
9410 = Device Code
q
JA
G
= Pb−Free Package
(Note: Microdot may be in either location)
Thermal Resistance, Junction−to−Ambient on
0.012” sq. (7.6 sq. mm) Collector pad on
FR−4 bd material
R
165
260
°C/W
°C
q
JA
ORDERING INFORMATION
Maximum Lead Temperature for Soldering
Purposes, 1/8” from case for 5 seconds
T
L
†
Device
Package
Shipping
MMJT9410G
SOT−223
(Pb−Free)
1000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2013
1
Publication Order Number:
August, 2013 − Rev. 7
MMJT9410/D