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MMBT2907A_08 PDF预览

MMBT2907A_08

更新时间: 2024-11-20 10:52:31
品牌 Logo 应用领域
美台 - DIODES 晶体晶体管
页数 文件大小 规格书
4页 132K
描述
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR

MMBT2907A_08 数据手册

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MMBT2907A  
PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR  
Please click here to visit our online spice models database.  
Mechanical Data  
Features  
Epitaxial Planar Die Construction  
Case: SOT-23  
Complementary NPN Type Available (MMBT2222A)  
Ideal for Low Power Amplification and Switching  
Lead, Halogen and Antimony Free, RoHS Compliant (Note 2)  
“Green” Device (Note 3)  
Case Material: Molded Plastic, “Green” Molding Compound,  
Note 3. UL Flammability Classification Rating 94V-0  
Moisture Sensitivity: Level 1 per J-STD-020D  
Terminal Connections: See Diagram  
Terminals: Matte Tin Finish annealed over Alloy 42 leadframe  
(Lead Free Plating) Solderable per MIL-STD-202, Method 208  
Qualified to AEC-Q 101 Standards for High Reliability  
Marking Information: See Page 4  
Ordering Information: See Page 4  
Weight: 0.008 grams (approximate)  
C
E
B
Top View  
Device Schematic  
Maximum Ratings @TA = 25°C unless otherwise specified  
Characteristic  
Collector-Base Voltage  
Symbol  
Value  
-60  
Unit  
V
VCBO  
VCEO  
VEBO  
IC  
Collector-Emitter Voltage  
-60  
V
Emitter-Base Voltage  
-5.0  
-600  
-800  
V
Collector Current - Continuous (Note 1)  
Peak Collector Current  
mA  
mA  
ICM  
Thermal Characteristics  
Characteristic  
Power Dissipation (Note 1)  
Symbol  
PD  
Value  
300  
Unit  
mW  
Thermal Resistance, Junction to Ambient (Note 1)  
Operating and Storage and Temperature Range  
417  
°C/W  
°C  
Rθ  
TJ, TSTG  
JA  
-55 to +150  
Notes:  
1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001, which  
can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.  
2. No purposefully added lead. Halogen and Antimony Free  
3. Product manufactured with Data Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date  
Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.  
1 of 4  
www.diodes.com  
September 2008  
© Diodes Incorporated  
MMBT2907A  
Document number: DS30040 Rev. 12 - 2  

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