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MMBD1501 PDF预览

MMBD1501

更新时间: 2024-11-28 22:46:07
品牌 Logo 应用领域
美微科 - MCC 整流二极管光电二极管
页数 文件大小 规格书
3页 147K
描述
High Conductance Low Leakage Diode 350mW

MMBD1501 技术参数

是否Rohs认证: 不符合生命周期:Active
包装说明:PLASTIC PACKAGE-3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.70风险等级:5.33
Is Samacsys:N配置:SINGLE
二极管元件材料:SILICON二极管类型:RECTIFIER DIODE
最大正向电压 (VF):0.72 VJESD-30 代码:R-PDSO-G3
JESD-609代码:e0最大非重复峰值正向电流:2 A
元件数量:1端子数量:3
最高工作温度:150 °C最大输出电流:0.2 A
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):240
最大功率耗散:0.35 W认证状态:Not Qualified
最大重复峰值反向电压:180 V子类别:Rectifier Diodes
表面贴装:YES端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

MMBD1501 数据手册

 浏览型号MMBD1501的Datasheet PDF文件第2页浏览型号MMBD1501的Datasheet PDF文件第3页 
MMBD1501(A)  
THRU  
MMBD1505(A)  
M C C  
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ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
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Features  
High Conductance  
Low Leakage Diode  
350mW  
l
l
l
l
Low Leakage  
Surface Mount Package Ideally Suited for Automatic Insertion  
150oC Junction Temperature  
High Conductance  
Mechanical Data  
l Case: SOT-23, Molded Plastic  
l Terminals: Solderable per MIL-STD-202, Method 208  
l Polarity: See Diagram  
SOT-23  
A
D
l Weight: 0.008 grams ( approx.)  
B
C
Maximum Ratings @ 25oC Unless Otherwise Specified  
F
E
Characteristic  
Working Inverse Voltage  
DC Forward Current  
Symbol  
VIV  
Value  
180  
Unit  
V
IF  
Io  
if  
600  
mA  
mA  
mA  
H
G
J
Average Rectified Current  
Recurrent Peak Forward Current  
200  
700  
K
1.0  
2.0  
DIMENSIONS  
MM  
Peak Forward Surge Current @  
t=1.0s  
@t=1.0ms  
if(surge)  
A
INCHES  
MIN  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
NOTE  
Power Dissipation  
Pd  
R
350  
357  
mW  
oC/W  
oC  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
Thermal Resistance  
Operation & Storage Temp. Range  
Tj, TSTG  
-55 to +150  
Note: 1) These ratings are based on a max. junction temperature of 150 degrees C  
2) These are steady state limits. T he factory should be consulted on applications  
involving pulsed or low duty cycle operation  
Electrical Characteristics @ 25oC Unless Otherwise Specified  
F
G
H
J
.100  
1.12  
.180  
.51  
.085  
.37  
K
Suggested Solder  
Pad Layout  
Charateristic  
Symbol Min  
Max Unit  
V
Test Cond.  
Breakdown Voltage  
BV  
200  
IR=5.0uA  
IF=1.0mA  
IF=10mA  
IF=50mA  
IF=100mA  
IF=200mA  
IF=300mA  
.031  
.800  
620  
720  
800  
750 mV  
850 mV  
950 mV  
.035  
.900  
Forward Voltage Drop  
VF  
0.83 1.1  
V
V
V
.079  
2.000  
inches  
mm  
0.87  
0.9  
1.3  
1.5  
VR=125V  
1.0  
3.0  
10  
nA  
uA  
nA  
uA  
VR=125V TA=150oC  
IR  
Reverse Current  
-----  
-----  
.037  
.950  
VR=180V  
VR=180V TA=150 C  
o
.037  
.950  
5.0  
Junction Capacitance  
Cj  
4
pF  
VR=0V, f=1.0MHz  
www.mccsemi.com  

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