MMBD1501
THRU
MMBD1505
M C C
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
20736 Marilla Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
TM
Micro Commercial Components
Features
High Conductance
Low Leakage Diode
350mW
ꢀ Low Leakage
ꢀ Surface Mount Package Ideally Suited for Automatic Insertion
ꢀ 150C Junction Temperature
ꢀ Lead Free Finish/Rohs Compliant ("P"Suffix designates
RoHS Compliant. See ordering information)
Mechanical Data
SOT-23
ꢀ Epoxy meets UL 94 V-0 flammability rating
A
D
ꢀ Moisture Sensitivity Level 1
ꢀ Polarity: See Diagram
ꢀ Weight: 0.008 grams ( approx.)
B
C
Maximum Ratings @ 25oC Unless Otherwise Specified
F
E
Characteristic
Working Inverse Voltage
DC Forward Current
Symbol
VIV
Value
180
Unit
V
IF
Io
if
600
mA
mA
mA
H
G
J
Average Rectified Current
Recurrent Peak Forward Current
200
700
K
1.0
2.0
DIMENSIONS
MM
Peak Forward Surge Current @
t=1.0s
@t=1.0ms
if(surge)
A
INCHES
MIN
DIM
A
B
C
D
E
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
MAX
3.04
2.64
1.40
1.03
2.05
.60
NOTE
Power Dissipation
Thermal Resistance,Junction to Ambient
Pd
RθJA
350
357
mW
oC/W
oC
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
Operation & Storage Temp. Range
Tj, TSTG
-55 to +150
Note: 1) These ratings are based on a max. junction temperature of 150 degrees C
2) These are steady state limits. T he factory should be consulted on applications
involving pulsed or low duty cycle operation
Electrical Characteristics @ 25oC Unless Otherwise Specified
F
G
H
J
.100
1.12
.180
.51
.085
.37
K
Suggested Solder
Pad Layout
Charateristic
Symbol Min
Max Unit
V
Test Cond.
Breakdown Voltage
BV
200
IR=5.0uA
IF=1.0mA
IF=10mA
IF=50mA
IF=100mA
IF=200mA
IF=300mA
.031
.800
620
720
800
750 mV
850 mV
950 mV
.035
.900
Forward Voltage Drop
VF
0.83 1.1
V
V
V
.079
2.000
inches
mm
0.87
0.9
1.3
1.5
IR
Reverse Current
-----
-----
.037
.950
10
5.0
nA
uA
VR=180V
o
.037
.950
VR=180V TA=150 C
Junction Capacitance
Cj
4
pF
VR=0V, f=1.0MHz
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Revision: B
2011/04/11