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MMBD1501_11 PDF预览

MMBD1501_11

更新时间: 2024-11-29 10:52:51
品牌 Logo 应用领域
美微科 - MCC 二极管
页数 文件大小 规格书
4页 209K
描述
High Conductance Low Leakage Diode 350mW

MMBD1501_11 数据手册

 浏览型号MMBD1501_11的Datasheet PDF文件第2页浏览型号MMBD1501_11的Datasheet PDF文件第3页浏览型号MMBD1501_11的Datasheet PDF文件第4页 
MMBD1501  
THRU  
MMBD1505  
M C C  
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents  
20736 Marilla Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
TM  
Micro Commercial Components  
Features  
High Conductance  
Low Leakage Diode  
350mW  
Low Leakage  
Surface Mount Package Ideally Suited for Automatic Insertion  
150C Junction Temperature  
Lead Free Finish/Rohs Compliant ("P"Suffix designates  
RoHS Compliant. See ordering information)  
Mechanical Data  
SOT-23  
Epoxy meets UL 94 V-0 flammability rating  
A
D
Moisture Sensitivity Level 1  
Polarity: See Diagram  
Weight: 0.008 grams ( approx.)  
B
C
Maximum Ratings @ 25oC Unless Otherwise Specified  
F
E
Characteristic  
Working Inverse Voltage  
DC Forward Current  
Symbol  
VIV  
Value  
180  
Unit  
V
IF  
Io  
if  
600  
mA  
mA  
mA  
H
G
J
Average Rectified Current  
Recurrent Peak Forward Current  
200  
700  
K
1.0  
2.0  
DIMENSIONS  
MM  
Peak Forward Surge Current @  
t=1.0s  
@t=1.0ms  
if(surge)  
A
INCHES  
MIN  
DIM  
A
B
C
D
E
MAX  
.120  
.098  
.055  
.041  
.081  
.024  
.0039  
.044  
.007  
.020  
MIN  
2.80  
2.10  
1.20  
.89  
1.78  
.45  
.013  
.89  
MAX  
3.04  
2.64  
1.40  
1.03  
2.05  
.60  
NOTE  
Power Dissipation  
Thermal Resistance,Junction to Ambient  
Pd  
RθJA  
350  
357  
mW  
oC/W  
oC  
.110  
.083  
.047  
.035  
.070  
.018  
.0005  
.035  
.003  
.015  
Operation & Storage Temp. Range  
Tj, TSTG  
-55 to +150  
Note: 1) These ratings are based on a max. junction temperature of 150 degrees C  
2) These are steady state limits. T he factory should be consulted on applications  
involving pulsed or low duty cycle operation  
Electrical Characteristics @ 25oC Unless Otherwise Specified  
F
G
H
J
.100  
1.12  
.180  
.51  
.085  
.37  
K
Suggested Solder  
Pad Layout  
Charateristic  
Symbol Min  
Max Unit  
V
Test Cond.  
Breakdown Voltage  
BV  
200  
IR=5.0uA  
IF=1.0mA  
IF=10mA  
IF=50mA  
IF=100mA  
IF=200mA  
IF=300mA  
.031  
.800  
620  
720  
800  
750 mV  
850 mV  
950 mV  
.035  
.900  
Forward Voltage Drop  
VF  
0.83 1.1  
V
V
V
.079  
2.000  
inches  
mm  
0.87  
0.9  
1.3  
1.5  
IR  
Reverse Current  
-----  
-----  
.037  
.950  
10  
5.0  
nA  
uA  
VR=180V  
o
.037  
.950  
VR=180V TA=150 C  
Junction Capacitance  
Cj  
4
pF  
VR=0V, f=1.0MHz  
www.mccsemi.com  
1 of 4  
Revision: B  
2011/04/11  

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