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MLG0603Q0N3CT PDF预览

MLG0603Q0N3CT

更新时间: 2024-09-16 05:15:59
品牌 Logo 应用领域
东电化 - TDK 测试射频感应器电感器
页数 文件大小 规格书
5页 75K
描述
General Purpose Inductor, 0.0003uH, 66.667%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

MLG0603Q0N3CT 数据手册

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(1/5)  
Conformity to RoHS Directive  
SMD Inductors(Coils)  
For High Frequency(Multilayer)  
MLG Series MLG0603Q Type∗  
This product will be removed from the catalog at the end of March, 2011. Please consider our new MLG0603P series of products with equivalent  
characteristics.  
FEATURES  
PRODUCT IDENTIFICATION  
MLG 0603 2N2  
(1) (2) (3) (4) (5) (6)  
• It serializes a product of inductance 0.2 to100nH. In a product of  
0.2 to 4.0nH, it realizes line up in a 0.1nH steps.  
• By the most suitable design, Q is higher than competing in a  
conventional product MLG0603S type. In particular, Q in more  
than 800MHz largely improved.  
Q
S
T
(1) Series name  
• Advanced monolithic structure is formed using a multilayering  
and sintering process with ceramic and conductive materials for  
high-frequency.  
(2) Dimensions  
0603  
0.6×0.3mm (L×W)  
• The products contain no lead and also support lead-free  
soldering.  
(3) Material code  
• It is a product conforming to RoHS directive.  
(4) Inductance value  
2N2  
12N  
2.2nH  
12nH  
APPLICATIONS  
For high-frequency applications including mobile phones, high  
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB  
and tuners.  
(5) Inductance tolerance  
B
C
S
H
J
0.1nH  
0.2nH  
0.3nH  
3%  
SHAPES AND DIMENSIONS  
0.6 0.03  
5%  
(6) Packaging style  
T
Taping (reel)  
0.06 0.04  
SPECIFICATIONS  
Operating temperature range  
Storage temperature range  
–55 to +125°C  
–55 to +125°C  
Weight: 0.2mg  
PACKAGING STYLE AND QUANTITIES  
0.15 0.05  
Dimensions in mm  
Packaging style  
Taping  
Quantity  
15000 pieces/reel  
RECOMMENDED PC BOARD PATTERN  
HANDLING AND PRECAUTIONS  
0.25  
0.3  
0.25  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the  
temperature difference between the solder temperature and  
product temperature does not exceed 150°C.  
Dimensions in mm  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• When hand soldering, apply the soldering iron to the printed  
circuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
10s max.  
250 to 260˚C  
230˚C  
Natural  
cooling  
180˚C  
150˚C  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
005-05 / 20101015 / e521_mlg0603q.

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