MLG0603Q0N6

更新时间： 2024-09-16 02:50:55

品牌	Logo	应用领域
东电化 - TDK		电感器
页数	文件大小	规格书
6页	75K
描述
SMD Inductors(Coils) For High Frequency(Multilayer)

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MLG0603Q0N6 数据手册

(1/6)

Conformity to RoHS Directive

SMD Inductors(Coils)

For High Frequency(Multilayer)

MLG Series MLG0603Q Type

FEATURES

PRODUCT IDENTIFICATION

MLG 0603 2N2

(1) (2) (3) (4) (5) (6)

• It serializes a product of acquisition inductance 0.3 to15nH. In a

product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe.

• By the most suitable design, Q is higher than competing in a

conventional product MLG0603S type. In particular, Q in more

than 800MHz largely improved.

(1) Multilayer ceramic chip coil

• Advanced monolithic structure is formed using a multilayering

and sintering process with ceramic and conductive materials for

high-frequency.

(2) Dimensions

0603

0.6× 0.3mm (L× W)

• The products contain no lead and also support lead-free

soldering.

(3) Series name

(4) Inductance value

APPLICATIONS

2N2

12N

2.2nH

12nH

For high-frequency applications including mobile phones, high

frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB

and tuners.

(5) Inductance tolerance

0.1nH

0.2nH

0.3nH

SHAPES AND DIMENSIONS

0.6 0.03

(6) Packaging style

Taping (reel)

0.06 0.04

SPECIFICATIONS

Operating temperature range

Storage temperature range

–55 to +125°C

–55 to +125°C [Unit of products]

Weight: 0.2mg

PACKAGING STYLE AND QUANTITIES

0.15 0.05

Packaging style

Taping

Quantity

15000 pieces/reel

Dimensions in mm

RECOMMENDED PC BOARD PATTERN

HANDLING AND PRECAUTIONS

• Before soldering, be sure to preheat components.

The preheating temperature should be set so that the

temperature difference between the solder temperature and

product temperature does not exceed 150°C.

0.2 to 0.3 0.25 to 0.35 0.2 to 0.3

Dimensions in mm

• After mounting components onto the printed circuit board, do not

apply stress through board bending or mishandling.

• When hand soldering, apply the soldering iron to the printed

circuit board only. Temperature of the iron tip should not exceed

350°C. Soldering time should not exceed 3 seconds.

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

10s max.

250 to 260˚C

230˚C

Natural

cooling

180˚C

150˚C

Preheating

60 to 120s

Soldering

30 to 60s

Time(s)

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• Please contact our Sales office when your application are considered the following:

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

• All specifications are subject to change without notice.

003-01 / 20070703 / e521_mlg0603q.fm

12 3 4 5 6

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与MLG0603Q0N6相关器件

型号	品牌	获取价格	描述	数据表
MLG0603Q0N6BT	TDK	获取价格	暂无描述
MLG0603Q0N6CT	TDK	获取价格	暂无描述
MLG0603Q0N6CT000	TDK	获取价格	General Purpose Inductor, 0.0006uH, 33.334%, 1 Element, SMD, 0603, CHIP, 0603, ROHS COMPLI
MLG0603Q0N7	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG0603Q0N7BT	TDK	获取价格	General Purpose Inductor, 0.0007uH, 14.286%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 060
MLG0603Q0N7CT	TDK	获取价格	General Purpose Inductor, 0.0007uH, 28.572%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 060
MLG0603Q0N8	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG0603Q0N9	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG0603Q0N9BT	TDK	获取价格	General Purpose Inductor, 0.0009uH, 11.112%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 060
MLG0603Q10N	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)

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