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MLG0603Q0N9 PDF预览

MLG0603Q0N9

更新时间： 2024-11-06 02:50:55
品牌 Logo 应用领域
东电化 - TDK 电感器
页数 文件大小 规格书
6页 75K
描述
SMD Inductors(Coils) For High Frequency(Multilayer)

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中文翻译

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MLG0603Q0N9 数据手册

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(1/6)  
Conformity to RoHS Directive  
SMD Inductors(Coils)  
For High Frequency(Multilayer)  
MLG Series MLG0603Q Type  
FEATURES  
PRODUCT IDENTIFICATION  
MLG 0603 2N2  
(1) (2) (3) (4) (5) (6)  
• It serializes a product of acquisition inductance 0.3 to15nH. In a  
product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe.  
• By the most suitable design, Q is higher than competing in a  
conventional product MLG0603S type. In particular, Q in more  
than 800MHz largely improved.  
Q
S
T
(1) Multilayer ceramic chip coil  
• Advanced monolithic structure is formed using a multilayering  
and sintering process with ceramic and conductive materials for  
high-frequency.  
(2) Dimensions  
0603  
0.6× 0.3mm (L× W)  
• The products contain no lead and also support lead-free  
soldering.  
(3) Series name  
(4) Inductance value  
APPLICATIONS  
2N2  
12N  
2.2nH  
12nH  
For high-frequency applications including mobile phones, high  
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB  
and tuners.  
(5) Inductance tolerance  
B
C
S
H
J
0.1nH  
0.2nH  
0.3nH  
3%  
SHAPES AND DIMENSIONS  
0.6 0.03  
5%  
(6) Packaging style  
T
Taping (reel)  
0.06 0.04  
SPECIFICATIONS  
Operating temperature range  
Storage temperature range  
–55 to +125°C  
–55 to +125°C [Unit of products]  
Weight: 0.2mg  
PACKAGING STYLE AND QUANTITIES  
0.15 0.05  
Packaging style  
Taping  
Quantity  
15000 pieces/reel  
Dimensions in mm  
RECOMMENDED PC BOARD PATTERN  
HANDLING AND PRECAUTIONS  
• Before soldering, be sure to preheat components.  
The preheating temperature should be set so that the  
temperature difference between the solder temperature and  
product temperature does not exceed 150°C.  
0.2 to 0.3 0.25 to 0.35 0.2 to 0.3  
Dimensions in mm  
• After mounting components onto the printed circuit board, do not  
apply stress through board bending or mishandling.  
• When hand soldering, apply the soldering iron to the printed  
circuit board only. Temperature of the iron tip should not exceed  
350°C. Soldering time should not exceed 3 seconds.  
RECOMMENDED SOLDERING CONDITION  
REFLOW SOLDERING  
10s max.  
250 to 260˚C  
230˚C  
Natural  
cooling  
180˚C  
150˚C  
Preheating  
60 to 120s  
Soldering  
30 to 60s  
Time(s)  
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific  
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.  
• Please contact our Sales office when your application are considered the following:  
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)  
• All specifications are subject to change without notice.  
003-01 / 20070703 / e521_mlg0603q.
123456

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