Datasheet > MLG0603Q0N5CT

MLG0603Q0N5CT

更新时间： 2024-11-06 15:43:19

品牌	Logo	应用领域
东电化 - TDK		测试射频感应器电感器
页数	文件大小	规格书
5页	109K
描述
General Purpose Inductor, 0.0005uH, 40%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

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MLG0603Q0N5CT 数据手册

(1/5)

Conformity to RoHS Directive

SMD Inductors(Coils)

For High Frequency(Multilayer)

MLG Series MLG0603Q Type^∗

∗

This product will be removed from the catalog at the end of March, 2011. Please consider our new MLG0603P series of products with equivalent

characteristics.

FEATURES

PRODUCT IDENTIFICATION

MLG 0603 2N2

(1) (2) (3) (4) (5) (6)

• It serializes a product of inductance 0.2 to100nH. In a product of

0.2 to 4.0nH, it realizes line up in a 0.1nH steps.

• By the most suitable design, Q is higher than competing in a

conventional product MLG0603S type. In particular, Q in more

than 800MHz largely improved.

(1) Series name

• Advanced monolithic structure is formed using a multilayering

and sintering process with ceramic and conductive materials for

high-frequency.

(2) Dimensions

0603

0.6×0.3mm (L×W)

• The products contain no lead and also support lead-free

soldering.

(3) Material code

• It is a product conforming to RoHS directive.

(4) Inductance value

2N2

12N

2.2nH

12nH

APPLICATIONS

For high-frequency applications including mobile phones, high

frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB

and tuners.

(5) Inductance tolerance

0.1nH

0.2nH

0.3nH

SHAPES AND DIMENSIONS

0.6 0.03

(6) Packaging style

Taping (reel)

0.06 0.04

SPECIFICATIONS

Operating temperature range

Storage temperature range

–55 to +125°C

Weight: 0.2mg

PACKAGING STYLE AND QUANTITIES

0.15 0.05

Dimensions in mm

Packaging style

Taping

Quantity

15000 pieces/reel

RECOMMENDED PC BOARD PATTERN

HANDLING AND PRECAUTIONS

0.25

0.3

0.25

• Before soldering, be sure to preheat components.

The preheating temperature should be set so that the

temperature difference between the solder temperature and

product temperature does not exceed 150°C.

Dimensions in mm

• After mounting components onto the printed circuit board, do not

apply stress through board bending or mishandling.

• When hand soldering, apply the soldering iron to the printed

circuit board only. Temperature of the iron tip should not exceed

350°C. Soldering time should not exceed 3 seconds.

RECOMMENDED SOLDERING CONDITION

REFLOW SOLDERING

10s max.

250 to 260˚C

230˚C

Natural

cooling

180˚C

150˚C

Preheating

60 to 120s

Soldering

30 to 60s

Time(s)

• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific

bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.

• Please contact our Sales office when your application are considered the following:

The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)

• All specifications are subject to change without notice.

005-05 / 20101015 / e521_mlg0603q.fm

12 3 4 5

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与MLG0603Q0N5CT相关器件

型号	品牌	获取价格	描述	数据表
MLG0603Q0N5CT000	TDK	获取价格	General Purpose Inductor, 0.0005uH, 40%, 1 Element, SMD, 0603, CHIP, 0603, ROHS COMPLIANT
MLG0603Q0N6	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG0603Q0N6BT	TDK	获取价格	暂无描述
MLG0603Q0N6CT	TDK	获取价格	暂无描述
MLG0603Q0N6CT000	TDK	获取价格	General Purpose Inductor, 0.0006uH, 33.334%, 1 Element, SMD, 0603, CHIP, 0603, ROHS COMPLI
MLG0603Q0N7	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG0603Q0N7BT	TDK	获取价格	General Purpose Inductor, 0.0007uH, 14.286%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 060
MLG0603Q0N7CT	TDK	获取价格	General Purpose Inductor, 0.0007uH, 28.572%, 1 Element, Ceramic-Core, SMD, 0603, CHIP, 060
MLG0603Q0N8	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)
MLG0603Q0N9	TDK	获取价格	SMD Inductors(Coils) For High Frequency(Multilayer)

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