Datasheet > MLG0603Q0N5CT000

MLG0603Q0N5CT000

更新时间： 2024-11-06 19:54:47

品牌	Logo	应用领域
东电化 - TDK		测试射频感应器电感器
页数	文件大小	规格书
2页	43K
描述
General Purpose Inductor, 0.0005uH, 40%, 1 Element, SMD, 0603, CHIP, 0603, ROHS COMPLIANT

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MLG0603Q0N5CT000 数据手册

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Multilayer Inductor for Ultra High

Frequency Range

MLG Series

Product Name

Series

Type

Part Number

0603Q Type

MLG0603Q0N5CT000

Product Lifecycle Stage PROD

Specification

Summary/Applications/Feature

Mounting Method Flag

Processing

Yes

Small size High-Q RF coil for high frequency

circuit of mobile application.

Summary

MULTI-LAYER

SMD

For high-frequency applications including

Applications mobile phones, high frequency modules (PA,

VCO, Rx etc.), Bluetooth and W-LAN.

Shape

Size Code

0603

Body Length(L)

Body Breadth(W)

Body Height(T)

Rated Inductance

Nom

0.6 m m

0.3 m m

0.5 n H

By the most suitable design, Q is higher than

competing in a conventional product

MLG0603S type. In particular, Q in more than

800MHz largely improved.

Nom

Min

Advanced monolithic structure is formed using

Feature

a multilayering and sintering process with

ceramic and conductive materials for high-

frequency.

-0.2 n H

0.2 n H

Inductance Tolerance

(Value)

Max

Lead free, lead free soldering, and RoHS

compliant

Test Frequency of

Inductance

Nom

100 M Hz

Min

Typ

Max

Nom

Max

10 G Hz

20 G Hz

Packaging

Self Resonant Frequency

Punched (Paper)Taping

[180mm Reel]

Packing

DC Resistance

Rated Current

0.1 Ohm

Minumum Package Qty Nom

Minimum Order Qty Nom

15000 Pcs

0.02 Ohm

600 m A

20 Cel

IDC1 ( Inductance Change) Max

IDC2 ( Temperature Rise)

Temperature Rise

Terminal Material

Polarity Marking

Max

Ag(100%)/Sn plating

Yes

Magnetic Shielding

Soldering Method

Reflow,Iron Soldering

Measuring Equipment(L, Q, Rdc) HP4291A

Min

Max

Min

Max

Nom

-55 Cel

125 Cel

-55 Cel

125 Cel

Category Temperature

Range

Storage Temperature Range

Weight

0.0002 g

[ Caution ]

http://roots.tdk.co.jp/rootsme.asp?ID=TJA024&NO=MLG0603Q0N5CT00022... 3/27/2009

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