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MCP87022_12 PDF预览

MCP87022_12

更新时间: 2024-09-14 12:27:23
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美国微芯 - MICROCHIP /
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16页 679K
描述
High-Speed N-Channel Power MOSFET

MCP87022_12 数据手册

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MCP87022  
High-Speed N-Channel Power MOSFET  
Features:  
Description  
• Low Drain-to-Source On Resistance (RDS(ON)  
)
The MCP87022 is an N-Channel power MOSFET in a  
popular PDFN 5 mm x 6 mm package. Advanced  
packaging and silicon processing technologies allow  
the MCP87022 to achieve a low QG for a given RDS(on)  
value, resulting in a low Figure of Merit (FOM).  
Combined with low RG, the low Figure of Merit of the  
MCP87022 allows high efficiency power conversion  
with reduced switching and conduction losses.  
• Low Total Gate Charge (QG) and Gate-to-Drain  
Charge (QGD  
)
• Low Series Gate Resistance (RG)  
• Fast Switching  
• Capable of Short Dead-Time Operation  
• ROHS Compliant  
Applications  
• Point-of-Load DC-DC Converters  
• High Efficiency Power Management in Servers,  
Networking and Automotive Applications  
Package Type  
PDFN 5 x 6  
8
7
6
5
S 1  
D
D
D
D
2
3
4
S
S
G
Product Summary Table: Unless otherwise indicated, T = +25˚C  
A
Parameters  
Operating Characteristics  
Sym  
Min Typ Max Units  
Conditions  
Drain-to-Source Breakdown Voltage  
BV  
25  
1
V
V
V
= 0V, I = 250 µA  
D
DSS  
GS  
DS  
Gate-to-Source Threshold Voltage  
Drain-to-Source On Resistance  
V
R
1.3  
1.6  
V
= V , I = 250 µA  
GS D  
GS(TH)  
DS(ON)  
2.2  
1.9  
2.6  
2.3  
29  
m  
mΩ  
nC  
V
V
V
= 4.5V, I = 25A  
D
GS  
GS  
DS  
= 10V, I = 25A  
D
Total Gate Charge  
Q
25.5  
= 12.5V, I = 25A, V = 4.5V  
D GS  
G
Gate-to-Drain Charge  
Series Gate Resistance  
Q
9
nC  
V
= 12.5V, I = 25A  
GD  
DS D  
R
1.3  
G
Thermal Characteristics  
Thermal Resistance Junction-to-X  
R
56  
˚C/W Note 1  
˚C/W Note 2  
θJX  
Thermal Resistance Junction-to-Case  
R
1.6  
θJC  
Note 1: RθJX is determined with the device surface mounted on a 4-Layer FR4 PCB, with a 1” x 1” mounting pad of  
2 oz. copper. This characteristic is dependent on user’s board design.  
2: RθJC is determined using JEDEC 51-14 Method. This characteristic is determined by design.  
2012 Microchip Technology Inc.  
DS25133B-page 1  

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