MCP87022
High-Speed N-Channel Power MOSFET
Features:
Description
• Low Drain-to-Source On Resistance (RDS(ON)
)
The MCP87022 is an N-Channel power MOSFET in a
popular PDFN 5 mm x 6 mm package. Advanced
packaging and silicon processing technologies allow
the MCP87022 to achieve a low QG for a given RDS(on)
value, resulting in a low Figure of Merit (FOM).
Combined with low RG, the low Figure of Merit of the
MCP87022 allows high efficiency power conversion
with reduced switching and conduction losses.
• Low Total Gate Charge (QG) and Gate-to-Drain
Charge (QGD
)
• Low Series Gate Resistance (RG)
• Fast Switching
• Capable of Short Dead-Time Operation
• ROHS Compliant
Applications
• Point-of-Load DC-DC Converters
• High Efficiency Power Management in Servers,
Networking and Automotive Applications
Package Type
PDFN 5 x 6
8
7
6
5
S 1
D
D
D
D
2
3
4
S
S
G
Product Summary Table: Unless otherwise indicated, T = +25˚C
A
Parameters
Operating Characteristics
Sym
Min Typ Max Units
Conditions
Drain-to-Source Breakdown Voltage
BV
25
1
—
—
V
V
V
= 0V, I = 250 µA
D
DSS
GS
DS
Gate-to-Source Threshold Voltage
Drain-to-Source On Resistance
V
R
1.3
1.6
V
= V , I = 250 µA
GS D
GS(TH)
DS(ON)
—
—
—
2.2
1.9
2.6
2.3
29
mΩ
mΩ
nC
V
V
V
= 4.5V, I = 25A
D
GS
GS
DS
= 10V, I = 25A
D
Total Gate Charge
Q
25.5
= 12.5V, I = 25A, V = 4.5V
D GS
G
Gate-to-Drain Charge
Series Gate Resistance
Q
—
—
9
—
—
nC
V
= 12.5V, I = 25A
GD
DS D
R
1.3
Ω
—
G
Thermal Characteristics
Thermal Resistance Junction-to-X
R
—
—
—
—
56
˚C/W Note 1
˚C/W Note 2
θJX
Thermal Resistance Junction-to-Case
R
1.6
θJC
Note 1: RθJX is determined with the device surface mounted on a 4-Layer FR4 PCB, with a 1” x 1” mounting pad of
2 oz. copper. This characteristic is dependent on user’s board design.
2: RθJC is determined using JEDEC 51-14 Method. This characteristic is determined by design.
2012 Microchip Technology Inc.
DS25133B-page 1